Latest Headlines

  1. Imec Unlocks System-Level III-V Chiplet Integration On Si-CMOS By Advancing Its 300mm RF Silicon Interposer Platform With High-Density MIMCAPs, Passive Modeling, And Laser-Assisted Bonding 6/11/2026

    Imec, a world-leading research and innovation hub in advanced semiconductor technologies, is evolving its 300mm RF silicon interposer into a system-level platform for the heterogeneous integration of III-V chiplets on Si-CMOS.

  2. Ampleon Introduces Fully Integrated 5G Massive MIMO GaN Power Amplifier Module With Intelligent Bias Control 6/11/2026

    Ampleon announces the G1M3438P70C, a fully integrated 70 W GaN Doherty power amplifier module designed to meet the demanding performance and integration requirements of 5G massive MIMO base stations.

  3. Guerrilla RF Launches Innovative GRF5847 Linear PA Module Featuring Fully Matched 50-Ohm Interfaces And IndustryLeading Output Power 6/10/2026

    Guerrilla RF, Inc., a leading provider of advanced radio frequency (RF) and microwave semiconductors, today announced the production launch of its innovative GRF5847 linear power amplifier (PA) module.

  4. ITRI Advances Taiwan-Europe 6G Collaboration At EuCNC & 6G Summit 6/10/2026

    At the 2026 EuCNC & 6G Summit, the Industrial Technology Research Institute (ITRI) strengthened Taiwan's engagement in the global 6G ecosystem through international partnership-building, technical exchange, and technology showcase.

  5. From 5G To 'Seeing Around The Corner': USC Engineer Shapes The Present And Future Of Wireless Communication 6/9/2026

    From the technology behind 5G and AirTags to collision warning systems in autonomous vehicles that can “see” around the corner, USC professor and researcher Andreas Molisch has spent three decades shaping the architecture of modern wireless communication.

  6. Square Peg Communications And VIAVI Solutions Join Forces To Advance 5G NTN Testing 6/9/2026

    Square Peg Communications, the company that enables the emulation and testing of complex satellite and hybrid networks, today announced a strategic partnership with VIAVI Solutions to deliver advanced test capabilities for the rapidly emerging 5G NTN market.

  7. Qorvo® Simplifies RF Control With SOI Portfolio That Eliminates Negative Bias 6/8/2026

    As defense, aerospace, and infrastructure systems demand wider bandwidths, more agile signal routing, and faster deployment cycles, RF designers are under increasing pressure to simplify increasingly complex architectures.

  8. MathWorks Highlights RF Digital Twin Workflows For Radar And Satellite Communications At IMS 2026 6/8/2026

    IMS 2026: Booth # 18090 – MathWorks, the leading developer of mathematical computing software for designing engineered systems, will highlight a digital twin capability at the International Microwave Symposium (IMS) 2026.

  9. MACOM Introduces Its Hot Via Chip Scale Technology To Eliminate Wire Bonds 6/8/2026

    MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, today announced a chip scale hot via process built on its AlGaAs diode technology.

  10. Ampleon Introduces High-Efficiency 5 GHz GaN Doherty Transistor Enabling Next-Generation Base Station Performance 6/8/2026

    Ampleon announces the C5H4850N55D, a high-efficiency 55 W GaN Doherty RF power transistor designed to meet the evolving demands of 5 GHz base station and multi-carrier communication systems.