Latest Headlines

  1. Highly Integrated Phased-Array Wireless IC Enables Dual-Polarized 6G Communication 8/4/2026

    A highly integrated phased-array wireless integrated circuit developed at Institute of Science Tokyo, Japan, enables 144 Gbps dual-polarized multiple-input multiple-output (MIMO) communication in the 150 GHz sub-terahertz band, bringing practical 6G devices a step closer to reality.

  2. DOCOMO Completes Japan's First Commercial Deployment Of Ericsson's Latest High-Capacity RAN Processor 6672 7/31/2026

    NTT DOCOMO, INC. ("DOCOMO"), in collaboration with Ericsson, has completed Japan's first*1 commercial deployment of Ericsson's latest high-capacity baseband solution, the RAN Processor 6672 ("the Solution").

  3. Ericsson Supplies RAN Compute Platform For NTT DOCOMO In Japan 7/31/2026

    Ericsson’s next-generation RAN Compute platform has been selected by NTT DOCOMO, INC. (DOCOMO) for its networks in Japan, including 5G.

  4. Quectel Launches FCE870X And FME170X Tri-Band Wi-Fi 7 Modules With Bluetooth 6.0 For Set-Top Boxes, Gaming Devices, And More 7/30/2026

    Quectel Wireless Solutions, a global end-to-end IoT solutions provider, today announces the launch of the FCE870X and FME170X tri-band Wi-Fi 7 modules, powered by the Synaptics SYN4384 chipset and designed for set-top boxes, gaming devices, digital signage, VR/AR headsets, smart gateways, and other high-performance connected products.

  5. Bourns Releases LTCC Low Pass Filters For Wireless Communication Applications Covering DC To 3800 MHz 7/30/2026

    Bourns today announced the release of the Model FLP1004N089D4, FLP1606N078D6, FLP1606N355D6, FLP1608N250D6, FLP2009N025D8, FLP2009N086D8, FLP2009N091D8, FLP2009N092D8, and FLP2009N141L3 LTCC (low-temperature co-fired ceramic) low pass filters, a family of nine models designed to address size constraints and frequency-selective filtering requirements in wireless communication designs.

  6. Quectel's FGH200M Wi-Fi HaLow Module, Built On Morse Micro's MM8108, Now FCC/IC/CE/RCM Certified For Mass Production 7/30/2026

    Morse Micro, the world’s leading Wi-Fi HaLow silicon provider, today announced that Quectel's FGH200M module has passed FCC/IC/CE/RCM certification. Built on Morse Micro's MM8108 system-on-chip, the module is now cleared for mass-market production, giving IoT device makers a validated path to Wi-Fi HaLow at scale.

  7. AEWIN Launched Ultra-Compact Fanless Network Appliance, SCB-6917 And SCB-6918 7/29/2026

    AEWIN proudly introduces the SCB-6917 and SCB-6918, compact fanless desktop network appliances powered by the Intel Atom X7203C/X7405C processor (codenamed Amston Lake-C).

  8. Fibocom LTE Cat.1 bis Module Receives KDDI Certification, Accelerating IoT Device Development And Deployment In Japan 7/29/2026

    Fibocom's LTE Cat.1 bis wireless communication module MG661-JP has received certification from KDDI, one of Japan's leading telecom operators.

  9. Quectel Launches High-Performance FCM665D Module For Edge AI Applications 7/29/2026

    Quectel Wireless Solutions, a global end-to-end IoT solutions provider, today announces the launch of the FCM665D, a high-performance Wi-Fi 6 and Bluetooth module with edge AI processing capabilities, designed for smart home, smart building and industrial IoT devices.

  10. Bourns LTCC Band Pass Filter – Balanced Type Integrates Balun And Impedance Matching For Sub GHz IoT RF Front Ends 7/28/2026

    Bourns today announced the Model FBD1608N080D6 LTCC (Low-Temperature Co-fired Ceramic) band pass filter - balanced type, a sub‑GHz RF filter‑integrated balun designed for wireless communication applications.