Highly Integrated Phased-Array Wireless IC Enables Dual-Polarized 6G Communication

New 150 GHz wireless module achieves 144 Gbps data transmission for high-speed 6G applications

A highly integrated phased-array wireless integrated circuit developed at Institute of Science Tokyo, Japan, enables 144 Gbps dual-polarized multiple-input multiple-output (MIMO) communication in the 150 GHz sub-terahertz band, bringing practical 6G devices a step closer to reality. By developing a highly integrated phased-array transceiver with a significantly smaller circuit footprint, the research paves the way for future applications such as immersive extended reality and remote healthcare services.

Compact Dual-Polarized Module for Ultra-Fast 6G Communication
Wireless communication forms an integral part of developing technologies. With ongoing demand, researchers are developing technologies that can handle enormous amounts of data for future digital services. To address this, sixth-generation (6G) mobile networks are expected to support applications such as extended reality (XR), which blends the physical and digital worlds, as well as remote healthcare and ultra-high-definition video streaming. These applications require compact wireless systems with high-speed data transfer that is far beyond that of today’s 5G networks.

To enable this, sub-terahertz waves (very high-frequency radio waves ranging from 100 to 300 GHz) can be used to carry much more information than the frequencies currently used for wireless communication. Now, a research team led by Specially Appointed Assistant Professor Yudai Yamazaki and Professor Kenichi Okada from the Department of Electrical and Electronic Engineering, School of Engineering, Institute of Science Tokyo, Japan, developed a compact antenna-in-package (AiP) wireless module capable of operating in the 150 GHz sub-terahertz band. Their findings were presented at the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, held in Honolulu, Hawaii, USA, from June 14 to 18, 2026, where the paper was selected as one of the conference's ten highlighted circuit papers and featured as the lead paper.

"We focused on multiple-input multiple-output (MIMO) technology, which uses multiple antennas to send and receive several data streams simultaneously," explains Okada. This increases both the wireless speed and network capacity. The researchers also employed a phased-array transceiver, in which multiple antennas work together to direct wireless beams toward a receiver. This beam steering improves signal quality and communication efficiency, making it a promising technology for future 6G wireless systems.

To make the technology practical for compact devices, the team designed a new circuit architecture that allows different parts of the transceiver (which transmits and receives wireless signals) to share signal pathways. This significantly reduced the amount of circuitry required, enabling a dual-polarized MIMO transceiver to be integrated onto a single chip. Dual polarization, which uses two perpendicular signal orientations, allows the same frequency band to carry more data without requiring additional radio spectrum.

The chip was then integrated into a compact AiP module, a technology that combines the antenna and electronic circuitry into a single package, reducing both size and signal loss. The researchers aimed to develop a compact wireless module that could support the extremely high data speeds expected for future 6G networks. By redesigning the circuit architecture, they were able to significantly reduce the circuit size while maintaining excellent communication performance.

With the use of the compact AiP module, the team was also able to demonstrate wireless communication at a maximum data transmission rate of 144 gigabits per second (Gbps). The results show that high-density integration can help overcome one of the biggest obstacles to practical sub-terahertz communication, making it easier for researchers to build compact, high-performance wireless devices for future networks.

This study can also support a wide range of data-intensive applications, including immersive XR experiences, digital twins, and remote healthcare services like future remote surgery, where surgeons rely on real-time transmission of ultra-high-definition medical images. Faster and more reliable wireless communication enables new services that may not be feasible with current mobile networks.

"We believe this technology lays an important foundation for future sub-terahertz wireless systems," says Okada.

Overall, the study presents the world's first realization of a highly integrated phased-array wireless integrated circuit capable of sub-terahertz dual-polarized MIMO communication. It successfully demonstrated ultra-high-speed wireless communication with a maximum data rate of 144 Gbps in communication experiments. Highly integrated wireless modules like this could help unlock the full potential of 6G by enabling faster and more reliable communication in a wide range of everyday applications. As research continues to grow, innovations that combine high performance with compact design are expected to play a key role in bringing next-generation wireless communication from the laboratory into practical use.