Latest Headlines

31. Linux Foundation And ATIS Partner To Advance Development And Integration Of Open Source, Open RAN Technologies 8/4/2025

    The Alliance for Telecommunications Industry Solutions (ATIS), a leading technology and solutions development organization for the information and communications technology industry, and the Linux Foundation, host of Linux Foundation Networking (LFN) and other open RAN software projects, today announced the signing of a Memorandum of Understanding (MOU).

32. AI-RAN Alliance And Linux Foundation Collaborate On Advancing AI-RAN 8/4/2025

    LF Networking (LFN), the de facto collaboration hub for open source networking projects under the Linux Foundation, and the AI-RAN Alliance, a global consortium dedicated to revolutionizing AI-RAN (Artificial Intelligence-Radio Access Networks), today announced a Memorandum of Understanding (MOU) to collaborate on accelerating innovation in AI-native networks and advancing the evolution toward 6G.

33. Princeton Will Lead U.S. Effort To Design Better Chips For Wireless Communication 8/4/2025

    Princeton University will lead a joint government-industry effort using AI to develop advanced semiconductors for wireless communication and remote sensing.

34. Empower RF Systems Announces New Wave Of Patents Strengthening Leadership In Advanced RF Power Amplifier Technology 8/1/2025

    Empower RF Systems, a recognized leader in RF and microwave power amplifier solutions, proudly announces the recent granting of several additional U.S. and international patents that further strengthen its position at the forefront of innovative amplifier technology.

35. To The Implementation Of High-Frequency Communication In The Real-World Applications Nitto Denko Corporation Signs Joint Development Agreement With BeammWave 7/31/2025

    Nitto Denko Corporation (Head Office: Osaka, Japan; President: Hideo Takasaki; hereinafter “Nitto”) is pleased to announce that it has entered into a joint development agreement with BeammWave (Head Office: Lund, Sweden; CEO: Stefan Svedberg) to collaborate on high-frequency communication technologies.

36. KAGA FEI Expands Wireless Module Lineup With Bluetooth 6 Support 7/31/2025

    KAGA FEI Co., Ltd., a global provider of leading short-distance wireless modules, today announced the expansion of its Bluetooth Low Energy module lineup with the introduction of the EC4L10BA1 and EC4L05BA1.

37. Airfide Unveils Wi-Fi HaLow Occupancy Sensor At COMNEXT Japan 7/31/2025

    Airfide Networks. has today announced the general availability of its next-generation of Micro-mobility occupancy sensor AFN6843, now enhanced with Wi-Fi HaLow connectivity.

38. AsiaRF Unveils Full Wi-Fi 7 Ecosystem: High-Speed Modules, Platforms, And Adapters For AI PC And Server Use 7/31/2025

    AsiaRF is excited to announce the launch of its comprehensive Wi-Fi 7 ecosystem, featuring a cutting-edge suite of wireless modules, advanced development platforms, and innovative adapter cards.

39. New Project To Develop Specification For Evaluating Conformance Of WInnForum Transceiver Facility Launches 7/30/2025

    The Wireless Innovation Forum (WInnForum) announces an open call for participation in its new Transceiver Conformance Work Group after a successful kick-off meeting 30 July.

40. New Transmitter Could Make Wireless Devices More Energy-Efficient 7/29/2025

    Researchers from MIT and elsewhere have designed a novel transmitter chip that significantly improves the energy efficiency of wireless communications, which could boost the range and battery life of a connected device.