Dielectric Laboratories (DLI) offers a series of single layer capacitors designed with Class II dielectric materials and X7R temperature stability characteristics for a variety of DC blocking or RF bypass applications. With operation capabilities over a broad frequency range, these high frequency, wire bondable capacitors are ideal for GaN, GaAs, filtering, tuning, and coupling applications where small size and microwave performance is vital for a circuit’s performance.
Plus, Huawei shrugs off U.S. aggression en route to a banner Q1, the U.S. preps for its largest spectrum auction ever, Verizon launches a 5G technology contest, and more, all in this edition of The Week in 5G.
This example describes a more developed 28 GHz antenna array capable of forming multiple beams for use in applications such as 5G network base stations. The system consists of three parts: a Rotman lens beamformer with seven input ports and eight output ports, a series of stripline Wilkinson power dividers to split each Rotman output into eight equal signals, and an 8x8 patch antenna array. The design process consists of three separate stages. This example will describe the creation of each stage of the device and evaluate the performance of the individual stages and the full device.
Powertrain electrification and automation are the key technology drivers that will ultimately lead to a new generation of all-electric, fully autonomous vehicles. At the same time, with the emergence of new business models, utilizing cloud and big data technologies, there will be a shift away from car ownership towards mobility services provided by new types of vehicle fleet operating companies. This white paper describes TE Connectivity’s vision for the next generation of mobility and its impact on vehicle architectures. It also shares how TE’s technology and portfolio address critical connectivity challenges the industry is experiencing.
There are several types of switches for radio frequency applications to choose from. Picking the right switch is a question of figuring out what speed, power levels, and lifetime you need.
Strict guidelines place more weight on reliability grade, size, and durability over other common parameters of importance for consumer electronics. This white paper explores regulation, testing procedures, and supplier considerations to assist in choosing the best components for each medical application.
Electronic Military & Defense was developed as a resource for engineers, program managers, project managers, and other professionals involved in the design and development of electronic and electro-optic systems for a wide range of defense and aerospace applications. Check out the digital edition of our latest issue for exclusive editorial on open architecture and standards applied to defense applications, overlooked EMC vulnerabilities, microfabrication, display technologies, and more.
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Corry Micronics, located in northwestern Pennsylvania, has been producing Feedthru Capacitors and Radio-Frequency Interference (RFI) Filters since 1970...
Nokia is making 5G deployments faster and more cost-efficient with its patent-pending 5G virtual testing environment. In its over-the-air validation area in Oulu, Finland, Nokia works with operators to simulate massive MIMO antenna beamforming performance by combining physical testing with a leading edge virtual environment.
Nordic Semiconductor recently announces that Boise, ID-based American Semiconductor, has selected Nordic’s nRF51822 Bluetooth Low Energy (Bluetooth LE) System-on-Chip (SoC) for its ‘AS_NRF51 FleX-BLE’, a flexible integrated circuit (IC) that supports Bluetooth LE wireless connectivity in what American Semiconductor claims is the world’s thinnest and smallest Chip Scale Package (CSP).
Raycap | STEALTH has announced its new patent-pending solution, InvisiWave, for use in the concealment of 5G mmWave small cell sites.
Cadence Design Systems, Inc. recently announced that it has collaborated with TSMC to enable customers’ production delivery of next-generation system-on-chip (SoC) designs for mobile, high-performance computing (HPC), 5G and artificial intelligence (AI) applications on TSMC’s 5nm FinFET process technology.
Skyworks is pleased to introduce the SKY85726-11, a 3.3V 5 GHz front-end solution for enterprise 802.11ax applications including access points, routers and gateways.
Silicon Labs (NASDAQ: SLAB) has introduced the next generation of its Wireless Gecko platform, Series 2, designed to make Internet of Things (IoT) products more powerful, efficient and reliable.
