Dielectric Laboratories (DLI) offers a series of single layer capacitors designed with Class II dielectric materials and X7R temperature stability characteristics for a variety of DC blocking or RF bypass applications. With operation capabilities over a broad frequency range, these high frequency, wire bondable capacitors are ideal for GaN, GaAs, filtering, tuning, and coupling applications where small size and microwave performance is vital for a circuit’s performance.
Plus, Huawei is embraced in Switzerland and welcomed in Germany, Google and Nokia preview new phones, and more, all in this edition of the Week in 5G.
Plus, Japan's KDDI partners with Ericsson and Nokia, KT and Hyundai apply 5G to construction sites, and more, all in this edition of the Week in 5G!
If you are looking to buy a new wireless networking gear or a mobile device, you may be overwhelmed by too many choices and abbreviations. Since Wi-Fi was first released to consumers in 1997, its standards have been continually evolving – typically resulting in faster speeds and network/spectrum efficiency – and it can be difficult to keep track of new standards. This paper is meant to help you understand the basics of Wi-Fi standards, and provides and overview of the evolution of Wi-Fi technologies.
There are any number of strategies that consumers can try to fix interference problems with Wi-Fi in their homes, but as an RF engineer, how can you design a Wi-Fi access point that addresses the biggest interference issues from the outset?
Plus, 4G LTE rollouts still going strong, a 5G phone for half the price of Samsung and Apple models, Austria's upcoming spectrum auction, and more, all in this edition of the Week in 5G.
Electronic Military & Defense was developed as a resource for engineers, program managers, project managers, and other professionals involved in the design and development of electronic and electro-optic systems for a wide range of defense and aerospace applications. Check out the digital edition of our latest issue for exclusive editorial on open architecture and standards applied to defense applications, overlooked EMC vulnerabilities, microfabrication, display technologies, and more.
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Remcom was formed in 1994 to develop and market software which would give our customers the capability to apply the Finite Difference Time Domain (FDTD) method to their particular applications...
Dielectric Laboratories is a global supplier of microwave and millimeter wave components for optical and wireless communications, military, medical, semiconductor, aerospace, and transportation markets. We are a manufacturer of High-Q Multi-Layer capacitors (MLC) and Single-Layer capacitors (SLC), Resonators, Filters, Broadband DC blocks, Thin Film components, and Custom ceramic components. In 2004, DLI acquired Voltronics Corporation, a world leader in precision variable capacitors.
Qualcomm Technologies, Inc., a wholly owned subsidiary of Qualcomm Incorporated, announced today at its 5G Summit in Barcelona, Spain that it is developing the first cellular chip optimized and certified for Microsoft’s Azure Sphere Internet of Things (IoT) operating system. Qualcomm Technologies’ new Azure Sphere-certified chipset for IoT will include hardware-level security, come preconfigured with the Azure Sphere, and will automatically connect to Azure Sphere security cloud services.
Richardson RFPD, Inc., an Arrow Electronics company, announced recently the availability and full design support capabilities for a new GaN power amplifier from MACOM Technology Solutions Inc.
Quectel Wireless Solutions, the leading global supplier of cellular and GNSS modules, recently announced that on September 25, it has completed the industry’s first 5G data call over its 5G millimeter wave (mmWave) module that fully complies with 3GPP Release 15 5G NR standards.
Siklu, a global leader in Fixed 5G millimeter wave technology for Gigabit Wireless Access, Smart City and security networks, announced today the general availability of its new EtherHaul™ 2-foot (61 cm) dual-band antenna (EH-ANT-2ft-DL5).
Skyworks Solutions, Inc., an innovator of high performance analog semiconductors connecting people, places and things, recently announced that its advanced connectivity solutions are powering next generation Wi-Fi 6 (802.11ax) devices from the world’s leading connected home and mesh network providers, including Arris, Asus, D-Link, Netgear, Ruckus and TP-Link.
TAIYO YUDEN CO., LTD. announced the launch of the new Bluetooth®*1 5 compatible wireless communications module, EYSKDNZWB (9.6×12.9×1.4 mm). This product is best suited for outdoor-use security devices, IoT devices used in large factories, and IoT-related devices that require long-distance communications capability such as physical distribution terminals.
