Latest Headlines

  1. Pasternack Expands Its Line Of Broadband Bias Tees 2/28/2023

    Pasternack, an Infinite Electronics brand and a leading provider of RF, microwave and millimeter-wave products, has just introduced an innovative series of bias tees.

  2. Huawei Launches One 5G Solutions To Drive All Bands To 5G 2/28/2023

    At the Mobile World Congress (MWC) Barcelona 2023, Huawei unveiled a full series of One 5G solutions, capable of driving all bands to 5G. 

  3. Quectel Announces Ultra-Wideband Automotive Grade Module, CCC And ICCE Compliant To Enable Newest Generation Digital Car Keys With Improved Location And Security Capabilities 2/28/2023

    Quectel Wireless Solutions, a global IoT and automotive solutions provider, today announces the launch of the ultra-wideband (UWB) automotive grade AU30Q module.

  4. Arctic Semiconductor And Compal Introduce World’s First Universal Small Cell Infrastructure Platform For 5G Networks 2/27/2023

    Arctic Semiconductor formerly known as SiTune Corporation, a leader in low-power, universal RF chipsets, today announced that its groundbreaking RF transceiver, IceWings™ is powering a new universal 5G small cell infrastructure platform from Compal Electronics, one of the world’s largest ODMs.

  5. Rohde & Schwarz Collaborates With Qualcomm And Iridium Communications To Test Snapdragon Satellite 2/27/2023

    Qualcomm Technologies Inc., Iridium Communications Inc. and Rohde & Schwarz recently collaborated on testing and validating Snapdragon Satellite, a solution for satellite-based connectivity on next-generation Android smartphones.

  6. Rohde & Schwarz Verifies NTN Capabilities Of Bullitt’s Smartphone, Powered By MediaTek 3GPP Rel.17 Chipset 2/27/2023

    Rohde & Schwarz has partnered with Bullitt and MediaTek to fully test and verify the world’s first satellite-to-mobile messaging 5G smartphone in line with 3GPP Release 17.

  7. MWC Barcelona 2023: Faststream’s 5G RU Platform Addresses The Growing Private And Public Network Opportunities 2/27/2023

    Faststream’s new DFE SoC combines hardened Digital Front End (DFE) blocks with adaptive logic DFE solution incorporating CFR, DPD, an integrated direct RF sampling transceiver and enables more processing per channel.

  8. Towards 6G: Rohde & Schwarz Showcases AI/ML-Based Neural Receiver With NVIDIA At MWC Barcelona 2/27/2023

    Rohde & Schwarz, working with NVIDIA, will present the industry’s first hardware-in-the-loop demonstration of a neural receiver, showing the achievable performance gains when using trained ML models compared to traditional signal processing.

  9. Telit Cinterion Expands 5G LPWA Module Portfolio With New Modules Featuring Sony's Altair ALT1350 Chipset 2/27/2023

    Telit Cinterion, a global enabler of the intelligent edge, today announced new ultra-compact 5G low-power wide area (LPWA) modules for a wide variety of indoor and outdoor IoT applications that require long battery life and long service life.

  10. Quectel Announces New Generation 5G Release 17 Module Series To Address Growing 5G FWA And eMBB Markets 2/27/2023

    Quectel Wireless Solutions, a global IoT solutions provider, today announces the launch of its latest generation 5G New Radio (NR) module series, the RG650E and RG650V, both of which follow the 3GPP Release 17 standard.