Latest Headlines

  1. LitePoint Accelerates Wi-Fi 8 Innovation With Qualcomm Technologies Through Advanced Testing 1/6/2026

    LitePoint, a leading provider of wireless test solutions, today announced it achieved PHY level validation on Qualcomm Technologies’ next-generation Wi-Fi 8 platforms using its industry-leading LitePoint IQxel-MX platform.

  2. QuantalRF CPL Antenna Models Added To Synopsys Simulation Component Libraries 1/6/2026

    CES — QuantalRF, the pioneering developer of RF semiconductor and antenna solutions, today announced its DockOn® antennas are now available in Ansys HFSS™ high frequency electromagnetic software component libraries — now part of the Synopsys line of simulation and analysis solutions.

  3. Telit Cinterion To Showcase Next-Generation IoT Modules, AI-Powered Edge Intelligence, And 5G Connectivity At CES 2026 1/5/2026

    Telit Cinterion, an end-to-end IoT solutions enabler, will unveil its latest innovations at CES 2026, presenting technologies and solutions that transform industrial automation, mining, and edge computing.

  4. Ericsson's 4.5 GHz Massive MIMO AIR 3255 Wireless Device Is Officially Commercially Available In DOCOMO 5G Networks 1/5/2026

    Ericsson's AIR 3255 Massive MIMO antenna integrated wireless device has recently been officially commercialized in the 5G network of Japanese operator NTT DOCOMO.

  5. Sony Outlines Vision For 5G eRedCap As The Next Step In IoT Connectivity 1/5/2026

    Sony Semiconductor Israel (Sony) today announced its long-term vision for 5G IoT connectivity, positioning eRedCap (enhanced Reduced Capability) as the foundation for the next generation of global, long-life connected Altair devices.

  6. World's First 802.15.4ab-UWB Chip Verified By Calterah And Rohde & Schwarz To Be Demoed At CES 2026 1/5/2026

    Calterah, a global leader in chip design for CMOS single-chip millimeter-wave radar sensors, together with Rohde & Schwarz, a world-leading company in test and measurement, has successfully demonstrated its next-generation solution for digital car keys based on the Dubhe-UWB-SoC chip (Ultra-Wideband; System-on-Chip).

  7. Quectel Announces Industry First 5G-Advanced 3GPP R18 Automotive-Grade Cellular Module, Delivering Unmatched Performance And Reliability 1/2/2026

    Quectel Wireless Solutions, an end-to-end global IoT solutions provider, today announces the launch of the world's first 5G-advanced (5G-A) automotive-grade cellular module, the AR588MA, establishing it as the industry's highest-performing and most reliable wireless communication product for vehicles.

  8. WARP Solution To Unveil AI Tracking And Beamforming-Based Wireless Power Transfer Platform At CES 2026 1/1/2026

    WARP Solution (CEO Kyunghak Lee) announced that it will unveil its AI tracking and beamforming-based wireless power transfer (WPT) platform at CES 2026, to be held in January in Las Vegas.

  9. RiseLink Showcases Ultra-Low-Power Edge AI And Wi-Fi SoCs Powering Next-Generation Smart Devices At CES® 2026 1/1/2026

    RiseLink, a global provider of high-performance, ultra-low-power Wi-Fi and AIoT system-on-chips (SoCs), today announced a series of activities at CES® 2026, highlighting how its edge AI and connectivity technologies are enabling scalable, production-ready smart devices.

  10. AmpliTech Group Achieves 100% Open RAN Handover Validation At POWDER OTIC PlugFest Featuring AT&T, DISH Wireless, Samsung, VMware, And Other Leading Global Participants 12/30/2025

    AmpliTech Group (NASDAQ: AMPG), today announced a major milestone in the commercialization of Open RAN technology.