Latest Headlines
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Digital Global Systems (DGS) Shifts The Power Of AI Back To The US
1/28/2025
Digital Global Systems (DGS), a leader in the detection, identification, classification, and geolocation of radio frequency signals, issued a statement today addressing recent developments with DeepSeek in the AI landscape and clarifying its unique approach to leveraging artificial intelligence for spectrum management.
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Junkosha Unveils Ultra Phase Stable Interconnect Advancements At DesignCon 2025
1/27/2025
Interconnect pioneers Junkosha have chosen North America’s largest chip, board and systems event, DesignCon 2025, to unveil its latest phase stable interconnect advancements including the MWX161, MWX001, MWX002 and MWX004, Junkosha Microwave/mmWave Coaxial Cable Assemblies – all designed to cater to the demands of a 5G/6G digital future.
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DOCOMO To Exhibit At MWC Barcelona 2025, World's Largest Connectivity Exhibition
1/24/2025
NTT DOCOMO, INC. announced today that it will exhibit at MWC Barcelona 2025, the world's largest connectivity exhibition, in Barcelona, Spain from March 3 to 6.
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Rohde & Schwarz Presents R&S ScopeStudio, A PC-Based Oscilloscope Solution To Boost Development Teams
1/23/2025
Rohde & Schwarz enhances its oscilloscope offerings with the launch of R&S ScopeStudio, an innovative application that brings the functionality of the MXO series oscilloscopes to a PC, often a more convenient and effective workspace.
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Franklin Access Secures Funding For Sigbeat Joint Venture, Advancing 4G/5G And AI Module Innovation
1/23/2025
Franklin Access (NASDAQ: FKWL) announced today the successful funding of its joint venture to develop 4G/5G modules and AI-powered solutions under the Sigbeat brand.
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AsiaRF Launches Wi-Fi 6, 6E, And Wi-Fi 7 Modules To Redefine Wireless Connectivity
1/23/2025
AsiaRF is accelerating the future of wireless technology with the launch of its latest Wi-Fi 6, Wi-Fi 6E, and Wi-Fi 7 modules.
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Verisilicon And Innobase Jointly Launch Second Generation Yunbao Series 5G RedCap/4G LTE Dual-Mode Modem IP
1/23/2025
VeriSilicon (688521.SH) has announced its collaboration with wireless communication technology and chip provider Innobase to jointly launch the second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP, Yunbao 2.
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RANsemi Introduces End-To-End 5G Open RAN Starter Kit
1/22/2025
RANsemi, a British wireless semiconductor innovator specialising in 5G Open RAN baseband technologies, today announced the launch of its 5G Open RAN Starter Kit designed to enable out-of-the-box testing and accelerate the development of 5G radio access networks (RANs).
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VeriSilicon And Innobase Collaboratively Launched Second-Generation Yunbao Series 5G RedCap/4G LTE Dual-Mode Modem IP
1/22/2025
VeriSilicon today announced the joint launch of the second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP, Yunbao 2, in collaboration with Innobase, a wireless communication technology and chip provider. This new modem IP has successfully completed production validation.
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Abracon Unveils Multiple Lines Of Innovative MEMs Oscillators To Electronics Market
1/22/2025
Abracon, a leading provider of Timing, Power, and RF solutions, has unveiled a broad line of MEMs oscillators, covering over 50 product series and comprising more than 1,700 individual part numbers to help meet the evolving needs of engineers and the demands of today's electronics-based industries.