Latest Headlines
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ZTE And MediaTek Unveil Tri-Band Wi-Fi 7, Targeting A Relatively Unexplored Premium Niche In Brazil
5/7/2026
ZTE Corporation, a global leading provider of integrated information and communication technology solutions, and MediaTek, a global semiconductor company and leader in the smartphone processor market, unveiled a joint strategy at the 2026 ZTE Broadband User Congress.
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GCT Semiconductor Signs Reference Platform Contract With Major Satellite Communications Provider To Fast-Track Global 5G Deployment
5/7/2026
GCT Semiconductor Holding Inc. (“GCT” or the "Company") (NYSE: GCTS), a leading designer and supplier of advanced 5G and 4G semiconductor solutions, today announced it has signed a reference platform agreement with one of the world’s largest satellite communications providers, supplementing a 5G/4G Chipset Licensing agreement executed in January.
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Rohde & Schwarz And Greenerwave Achieve Precise And Fast ESA Antenna Characterization Using Near-Field Technology
5/7/2026
A joint measurement trial, Rohde & Schwarz and Greenerwave have demonstrated that a near-field system can record a full radiation pattern of a 50 cm Ku band electronically steerable array for a SATCOM antenna in just half an hour.
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Morse Micro Partners With DigiKey To Expand Global Access To Wi-Fi HaLow Solutions
5/7/2026
Morse Micro, the world’s leading Wi-Fi HaLow silicon provider, today announced a distribution partnership with DigiKey, the global distribution leader of electronic components and automation products.
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Tachyon Networks Expands FWA Portfolio With $1.5M Development Partnership With Sivers Semiconductors
5/6/2026
Sivers Semiconductors AB, a global leader in photonics and wireless technologies, today announced a new $1.5M development partnership with Tachyon Networks Inc., for a 60 GHz mmWave transceiver for the FWA market.
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Fraunhofer IIS Tests High Bandwidths For Non Terrestrial Networks (NTN)
5/6/2026
In April 2026, the Fraunhofer Institute for Integrated Circuits IIS successfully demonstrated a broadband 5G NTN connection in the Ka-band frequency range via the geostationary (GEO) satellite Heinrich Hertz.
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This Algorithmic Framework Is Discovering Novel Chip Designs Never Invented Before
5/6/2026
USC researchers invent a chip design method that could accelerate the design of the next generation of wireless devices, from 5G phones to autonomous vehicles, by unlocking designs that traditional chip engineering could never reach.
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Samsung And Qualcomm Achieve Industry-First Power Class 1 Validation For 5G Fixed Wireless Access On Virtualized RAN
5/6/2026
Samsung Electronics today announced a significant advancement in Fixed Wireless Access (FWA) technology, successfully validating 5G Power Class 1 (PC1) capability through its virtualized RAN (vRAN) and the Qualcomm Dragonwing FWA Gen 4 Platform featuring the Qualcomm X85 Modem-RF chipset.
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Ampleon Launches High-Voltage LDMOS Macro Driver Platform With Integrated Doherty MMICs For Efficient, Simplified 4G/5G Base Stations, Featuring A 2.6 GHz Flagship Driver
5/4/2026
Ampleon announces the B10H27N70D, a flagship product in its novel High-Voltage LDMOS Macro Driver platform, enabling uncompromised drive of high-power GaN-SiC transistors in macro base stations.
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Optical Antenna Allows In-Flight Communication Between Drones Using UV Light
4/30/2026
Researchers have developed a new optical antenna for wireless ultraviolet (UV) communication that captures and amplifies signals from a broad area.