Latest Headlines

  1. Saelig Introduces Micsig MHO 6 Series 12-bit 1GHz 8-ch Oscilloscopes 6/29/2026

    Saelig Company, Inc. has introduced the MHO 6 series 12-bit high-resolution oscilloscopes with 350MHz/500MHz/1GHz bandwidth, 6GSa/s sampling rate, 8 analog channels, and a storage depth of 1.8Gpts.

  2. KYOCERA AVX Releases New Web-Based Antenna Integration Tool 6/29/2026

    KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released a new web-based RF engineering tool — the Antenna Integrator Studio.

  3. Antenna Array Could Provide Protected Tactical Satellite Communications In Low-Earth Orbit 6/26/2026

    Preventing adversaries from interfering with communications is crucial to national security.

  4. Lund University First In The World To Develop A 256-Antenna System For Future 6G Communication 6/25/2026

    Researchers at the Faculty of Engineering (LTH) at Lund University in Sweden have developed one of the world’s most advanced test environments for the wireless communications of the future.

  5. STMicroelectronics Unveils World's First ST54M Secure Mobile Chip With Post-Quantum Cryptography For Next-Generation Connected Services 6/24/2026

    STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced the ST54M, a secure mobile chip designed to help smartphone and personal electronics manufacturers meet upcoming quantum-ready security requirements while supporting a seamless user experience across connected services.

  6. Quectel Introduces NXP Based FCM365X Wi-Fi 6, Bluetooth LE 5.4, Zigbee, And Thread Module For Smart Home And Industrial IoT Solutions 6/24/2026

    Quectel Wireless Solutions, a global end-to-end IoT solutions provider, today announces the launch of the FCM365X, a dual-band Wi-Fi 6 and Bluetooth Low Energy (BLE) 5.4 module that is based on the NXP Semiconductors RW612 wireless MCU and supports multiple protocols, including Zigbee and Thread.

  7. GCT Semiconductor Announces Strategic Commitment To Powering The AI-Edge Data Pipeline 6/23/2026

    GCT Semiconductor Holding, Inc. (“GCT”), a leading designer and supplier of 5G semiconductors powering the AI data pipeline with wireless connectivity, today announced a strengthened strategic focus on enabling the global expansion of artificial intelligence (AI) infrastructure.

  8. RANsemi And TechPhosis Enable 5G OCUDU For Integrated Small Cells 6/23/2026

    RANsemi Limited, the British semiconductor innovator pioneering Open RAN baseband System-on-Chip (SoC) platforms for 5G networks, and TechPhosis Private Limited, one of India’s leading 5G CU/DU stack solution providers and Open RAN integration specialists, have integrated the Linux Foundation’s open source 5G OCUDU CU/DU software stack with the RANsemi RNS802 baseband PHY using the Small Cell Forum (SCF) FAPI interface.

  9. Iridium's Next Generation Hybrid IoT Module And Development Kit Are Now Commercially Available 6/23/2026

    Iridium Communications Inc. (Nasdaq: IRDM), a leading provider of global voice, data, and positioning, navigation, and timing (PNT) satellite services, today announced commercial availability of the Iridium® 9604 module and Development Kit, giving developers, OEMs, and solution providers a faster path to build and scale connected IoT solutions worldwide.

  10. GlobalFoundries Qualifies SLATE™ Advanced Packaging Technology On 9SW Platform For Next-Generation Radio Frequency Applications 6/23/2026

    GlobalFoundries (Nasdaq: GFS) (GF) today announced the production readiness of its SLATE™ wafer-to-wafer bonding technology on its industry-leading 9SW radio-frequency silicon-on-insulator (RF-SOI) platform, delivering advanced 3D integration (3DI) for compact, high-performance cellular front-ends. Manufactured at GF’s 300mm facility in Singapore, 9SW SLATE technology is expected to ramp to volume production by the second half of 2027.