Latest Headlines
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Fibocom Drives The Rapid Growth In The Economics Of IoT Scale With Ultra-Compact Size Cat 1 bis Module MC610-GL At MWC Shanghai 2024
6/26/2024
Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, announces the new member of its LTE Cat 1 bis module portfolio featuring high reliability, ultra-compact size and cost-effectiveness at MWC Shanghai 2024.
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AsiaRF Unveils Revolutionary Wi-Fi HaLow Mesh Technology For Enhanced AIoT Connectivity
6/25/2024
AsiaRF, a pioneering brand in wireless communication solutions, proudly announces the groundbreaking development of Wi-Fi HaLow Mesh technology.
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TDL Gentek Announces Strategic Partnership With Teltonika To Enter The LTE, IoT, And M2M Markets
6/25/2024
TDL Gentek, a leading Canadian distributor of technology products for; MSPs, LTE Carriers/Dealers, IT Service providers, and Security providers, is excited to announce a strategic partnership with Teltonika.
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Introducing The Cavli C17QS: Harnessing The Power Of Low Power Cat 1bis Technology With Integrated SDK
6/25/2024
Cavli Wireless, one of the first truly 'IoT-ready' cellular module manufacturers, proudly announces the launch of the new C17QS Cat 1bis cellular IoT module in the Türkiye market.
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HaiLa Technologies And e-peas Semiconductor Showcase First Battery-Free, Wi-Fi-Based Extreme-Low-Power Backscatter Chip Powered By Ambient Light
6/24/2024
HaiLa Technologies Inc., a fabless semiconductor and software company focusing on hyper power-efficient wireless communications system-on-chip (SoC) solutions for IoT devices, and e-peas Semiconductor, an industry-leading provider of energy harvesting and processing solutions, have collaborated to show the path to extreme long-life energy storage for Wi-Fi connected wireless sensors.
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Rohde & Schwarz Joins AI-RAN Alliance And Leverages Its T&M Expertise To Unlock Potential Of AI For Wireless Communications
6/24/2024
Rohde & Schwarz has become the latest member of the recently formed AI-RAN Alliance. As a global leader in wireless testing, the company will contribute its T&M expertise to this new collaborative initiative, which aims to integrate artificial intelligence (AI) into wireless communications to advance radio access network (RAN) performance and mobile networks.
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Renesas Completes Acquisition Of Transphorm
6/20/2024
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced that it has completed the acquisition of Transphorm, Inc. (“Transphorm” Nasdaq: TGAN), a global leader in gallium nitride (GaN) power semiconductors, as of June 20, 2024.
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InnoPhase IoT Unveils Talaria TWO Matter v1.2 Certified Wi-Fi Solution
6/20/2024
InnoPhase IoT, Inc., a fabless semiconductor company specializing in ultra-low power Wi-Fi IoT solutions, announces the availability of its Talaria TWO Matter v1.2 certified Wi-Fi solution.
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Mobix Labs Collaborates To Develop Low-Cost, Energy-Efficient 5G Base Station Solutions
6/20/2024
Mobix Labs Inc., a fabless semiconductor company specializing in next-generation connectivity solutions, today announced a strategic partnership with TalkingHeads Wireless (THW) to develop a new generation of cost-effective, energy-efficient 5G base stations.
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Cambium Networks' PMP 450v Achieves Full FCC Certification, Enabling Superior Performance And Flexibility
6/20/2024
Cambium Networks (NASDAQ: CMBM), a leading global provider of networking solutions, today announced the full FCC and ISED certification of the PMP 450v Fixed Wireless Access Point and Subscriber Module, expanding its advanced connectivity solutions in the 6 GHz spectrum.