Latest Headlines
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Keysight And Synopsys Deliver An AI-Powered RF Design Migration Flow For Transition From TSMC's N6RF+ To N4P Process Node
6/5/2025
Keysight Technologies, Inc.and Synopsys, Inc. introduced an AI-powered RF design migration flow to expedite migration from TSMC’s N6RF+ process to N4P technology, to address the performance requirements of today’s most demanding wireless integrated circuit applications.
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STMicroelectronics Announces Mass Production And Lead Customer Success For Turnkey Bluetooth/Wi-Fi Modules Developed With Qualcomm
6/4/2025
STMicroelectronics has announced mass-production start for its ST67W611M1 combined Wi-Fi 6 and Bluetooth Low Energy 5.4 module, describing the early success of Siana, a lead customer for its fast-to-market connectivity.
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Airgain Launches AirgainConnect Go-Kit Pro: The Most Compact Mobile Rapid Response 5G Connectivity Kit For First Responders And Remote Operations
6/4/2025
Airgain, Inc, a leading provider of advanced wireless connectivity solutions, today announced the availability of AirgainConnect Go-Kit Pro, the most compact Mobile Rapid Response 5G Connectivity Kit available today.
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Vishay Intertechnology Introduces New High-Reliability Isolation Amplifiers With Industry-Leading CMTI For Precision Applications
6/4/2025
Vishay Intertechnology, Inc. today announced the release of its latest isolation amplifiers, the VIA0050DD, VIA0250DD, and VIA2000SD.
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DeepSig Testifies Before Congress On AI Transforming Wireless And Driving 6G
6/4/2025
Today, DeepSig CEO Jim Shea will testify before the U.S. House Energy and Commerce Subcommittee on Communications and Technology during its hearing, “AI in the Everyday: Current Applications and Future Frontiers in Communications and Technology.
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Silicon Labs And Wirepas Surpass 10 Million Chipsets, Powering Industrial IoT At Scale
6/3/2025
Silicon Labs (NASDAQ: SLAB), the leading innovator in low-power wireless solutions, and Wirepas, a global leader in decentralized IoT connectivity, today announced they have shipped 10 million wireless SoCs running Wirepas' RF mesh connectivity software, primarily in the Indian market with the Silicon Labs sub-GHz FG23 SoC.
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Morse Micro And Gateworks Partner To Deliver Industrial Connectivity With Wi-Fi Halow
6/3/2025
Morse Micro, the world's leading provider of Wi-Fi HaLow chips and Gateworks Corporation, a leading supplier of industrial single board computers (SBCs), today announced they have partnered to bring Wi-Fi HaLow (IEEE 802.11ah) connectivity to the toughest industrial environments.
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Driving 5G Innovation: Ericsson And Telstra Unveil Triple-Band FDD Massive MIMO Radio For Next-Generation Network Performance
6/2/2025
In yet another pioneering move, Ericsson and Telstra have announced the commercial deployment of the AIR 3284, the world’s first 5G triple-band FDD Massive MIMO radio, delivering a step-change in coverage, capacity, and performance that will serve as a cornerstone of Telstra’s four-year network transformation.
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Vantiva And Hi3G Denmark Partner To Launch Falcon 5G — A High-Performance Fixed Wireless Access Solution For Faster, More Efficient Connectivity
6/2/2025
Vantiva, a global leader in connectivity technologies, today announced its partnership with Hi3G Denmark to launch Falcon 5G, a premium indoor wireless access (FWA) solution designed to deliver world-class 5G connectivity.
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LITEON And ASOCS Announce Integration Of LITEON Radio Unit With ASOCS RAN Software To Deliver High-Performance Private 5G Solutions For Industry 4.0
6/2/2025
LITEON Technology Corporation (https://www.liteon.com/en), a global leader in power management and optoelectronic technologies, proudly announces its strategic collaboration with ASOCS (www.asocscloud.com), a pioneer in virtualized RAN (vRAN) solutions.