Latest Headlines
-
SynaXG Collaborates With Wind River And Ampere To Accelerate Next-Level O-RAN Integration
2/28/2024
MWC Barcelona 2024 – SynaXG, a leading provider of converged AI+5G and O-RAN network solutions, today announced a strategic collaboration with Wind River and Ampere® Computing to deliver breakthrough technology for O-RAN infrastructure.
-
Pasternack's New High-Power RF Fixed Attenuators Feature Durable 2.4 mm Connectors
2/28/2024
Pasternack, an Infinite Electronics brand and a leading provider of RF, microwave and millimeter-wave products, has announced the introduction of high-power RF fixed attenuators with 2.4 mm connectors.
-
DeepSig Announces Commercial Release Of Industry’s First Neural Receiver Software For Open RAN 5G Networks
2/28/2024
DeepSig, a pioneer in AI-native wireless communications, announced today at Mobile World Congress the general availability (GA) of its Gen 1 OmniPHY 5G software.
-
Rohde & Schwarz Receives GTI Award 2024 For Its 5G RedCap Test Solution
2/28/2024
Rohde & Schwarz received the Innovative Breakthrough in Mobile Technology Award at GTI Awards 2024 for its R&S CMX500 radio communication tester’s support of RedCap testing from early R&D to certification and conformance. The GTI Awards takes place during Mobile World Congress and recognizes industry achievements and successes in 5G development across a wide range of market segments.
-
Rohde & Schwarz And Samsung Pave The Way For Adoption Of Secure Ranging Test Cases Defined By The FiRa Consortium
2/28/2024
Rohde & Schwarz and Samsung have collaborated to verify secure ranging test cases for the ultra-wideband (UWB) PHY layer and assess the secure receiver characteristics of devices based on FiRa specifications. There are new test cases specified in the FiRa 2.0 Technical Specifications, which covers the prevention of physical layer attacks on secure ranging applications based on UWB technology. These test cases were verified with the R&S CMP200 radio communication tester from Rohde & Schwarz on Samsung’s latest UWB chipset.
-
Hitachi Energy Expands Its Tropos Industrial Wireless Portfolio
2/27/2024
Hitachi Energy launches the TRO670 hybrid wireless router, the latest addition to its TRO600 series of high-throughput and low-latency industrial wireless communications devices to support a host of smart grid and Industrial Internet of Things (IIoT) applications.
-
ALifecom And SUTD Sign MOU On Non-Terrestrial Network Testing Solution
2/27/2024
ALifecom and Singapore University of Technology and Design (SUTD) announced today at Mobile World Congress 2024 the signing of a Memorandum of Understanding (MOU) outlining their collaboration to accelerate Non-Terrestrial Network (NTN) Testing, Verification, and Integration with ORAN network.
-
IDTechEx Discusses Advancing Integration In Antenna Packaging Technologies For 5G And 6G
2/27/2024
Millimeter-wave (mmWave), previously confined to military, satellite, and automotive radar applications, has now entered the mobile communications frequency spectrum, offering high data throughput of up to 20 Gbps with an ultralow latency of just 1 ms.
-
Fairview Microwave Unveils RF Fixed Attenuators And Terminations Up To 26 GHz
2/27/2024
Fairview Microwave, an Infinite Electronics brand and a leading provider of RF, microwave and millimeter-wave products, has announced the launch of its latest product line: RF fixed attenuators and terminations with an operational frequency reaching up to 26 GHz.
-
Lattice Extends ORAN Solution Stack With Integrated 5G Small Cell Bridging Capabilities For Next-Generation Wireless Infrastructure
2/26/2024
Lattice Semiconductor, the low power programmable leader, today announced its latest updates of the Lattice ORAN solution stack, enabling integrated 5G small cells with low power and flexible bridging capabilities.