Latest Headlines

  1. VeriSilicon Introduces FD-SOI Wireless IP Platform For Diverse IoT And Consumer Electronics Applications 9/23/2025

    VeriSilicon (688521.SH) today introduced its wireless IP platform, designed to help customers rapidly develop energy-efficient, highly integrated chips for a wide range of IoT and consumer electronics applications.

  2. Samsung Electronics Joins Global Consortium To Secure And Commercialize 6G Technology 9/23/2025

    Samsung Electronics is leading the future of 6G technology together with global big tech companies.

  3. Morse Micro Announces Mass Production Of MM8108 Wi-Fi HaLow SoC, Modules, Evaluation Kit And HaLowLink 2 9/23/2025

    The Things Conference – Morse Micro, the world's leading provider of Wi-Fi HaLow silicon solutions, today announced the mass production and general availability of its second-generation MM8108 System-on-Chip (SoC).

  4. Verizon Leads The Future Of Wireless With Development Of New Industry 6G Forum 9/22/2025

    The nation’s industry-leading network provider is once again shaping the future of wireless technology with the establishment of the Verizon 6G Innovation Forum – a group of companies driving innovation and enabling the 6G era.

  5. Semtech LoRa Gen 4 Addresses Low-Power Wireless Range And Speed Limitations 9/22/2025

    Semtech Corporation, a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, today announced two new LoRa Gen 4 transceivers that extend the breakthrough capabilities of the LR2021 into cost-optimized and application-specific solutions.

  6. Nokia Wins Significant 5G Deal With VodafoneThree 9/22/2025

    Nokia today announced it has been selected by VodafoneThree in a significant new eight-year deal to supply equipment from its market-leading AirScale Radio Access Network (RAN) and Core Networks portfolio in the UK.

  7. TTM Technologies, Inc. Expands Ultra Small Radio Frequency Components Offering For Telecom, Test And Measurement, And COTS Mil-Aero Applications 9/19/2025

    TTM Technologies, Inc. (“TTM”), a leading global manufacturer of technology solutions, including mission systems, radio frequency (“RF”) components, RF microwave/microelectronic assemblies, and quick-turn and technologically advanced printed circuit boards (“PCB”s) continues to innovate in the field of Radio Frequency & Specialty (“RF&S”) components with the introduction of new ultra small RF crossover and splitter components.

  8. SoftBank Corp. Develops High-Capacity 6-Cell Capable HAPS Payload, Delivers 5G Connectivity From The Sky In Field Trial 9/18/2025

    SoftBank Corp. (President & CEO: Junichi Miyakawa, "SoftBank") today announced it newly developed a 6-cell capable communications payload for High Altitude Platform Station (HAPS) stratospheric-based wireless communications that successfully delivered 5G connectivity from the sky to the ground in a field trial.

  9. Nordic Semiconductor Expands The nRF54L Series With nRF54LM20A, A High-Memory Wireless SoC For Advanced Bluetooth LE And Matter Applications 9/18/2025

    Nordic Semiconductor, a global leader in low power wireless connectivity solutions, today announced the launch of the nRF54LM20A, the latest addition to its next-generation nRF54L Series of ultra-low power wireless SoCs.

  10. Samsung And TELUS Collaborate On Canada's First AI-Powered RAN Intelligent Controller To Optimize Network Performance And Energy Efficiency 9/18/2025

    Samsung Electronics and TELUS today announced that they will deploy Canada’s first commercial Radio Access Network Intelligent Controller (RIC), marking a significant milestone toward fully software-based, AI-powered networks.