Latest Headlines

  1. Strategy Analytics: One Billion Smartphones Worldwide Have Wireless Charging 6/29/2021

    According to new research from Strategy Analytics, the installed base of wireless charging capable smartphones will reach the record setting one billion mark by the end of this year.

  2. Fairview Microwave Debuts New RF Loads With 1.85mm, 2.4mm, 2.92mm, 3.5mm, SMP And SMPM Connectors 6/29/2021

    Fairview Microwave Inc., an Infinite Electronics brand and a leading provider of on-demand RF, microwave, and millimeter wave components, has broadened its selection of RF loads to address a range of applications involving test, R&D, production, commercial and military RF communications systems.

  3. u blox Presents Bluetooth AoA Explorer Kits For High Precision Indoor Positioning 6/29/2021

    u‑blox, a leading global provider of positioning and wireless communication technologies and services, has announced the release of two “explorer kits” aimed at letting product developers evaluate the potential of Bluetooth direction finding and high precision indoor positioning.

  4. C-V2X Automotive Programme Launched 6/29/2021

    The Global Certification Forum (GCF) and the 5G Automotive Association (5GAA) today announced a partnership that will support the drive for interoperability, reliability, and safety of emerging cellular vehicle-to-everything (C-V2X) systems.

  5. Taoglas Launches Industry-Leading EDGE System-On-Module Portfolio For Rapid IoT Deployment 6/29/2021

    Taoglas, a leading enabler of digital transformation through IoT, today launched its comprehensive System-on-Module (SoM) portfolio for instant IoT development, designed for a range of technology applications including transportation, remote healthcare and smart buildings.

  6. Peraso High Performance mmWave Modules Enable Multigigabit Links At 25kms 6/29/2021

    Peraso Technologies Inc. today announced the immediate availability of the PRM2141 IEEE802.11ad/ay module.

  7. X-FAB Introduces Analog/Mixed-Signal Reference Design Kit For Siemens’ Tanner IC Design Tools 6/29/2021

    X-FAB Silicon Foundries SE, the leading specialty foundry, has announced the release of a reference design kit for Tanner analog/mixed-signal (AMS) software from the EDA segment of Siemens Digital Industries Software.

  8. NXP Brings GaN To 5G Multi-Chip Modules For Energy-Efficient Mobile Networks 6/28/2021

    NXP Semiconductors N.V. (NASDAQ: NXPI) today announced a major industry milestone for 5G energy efficiency with the integration of Gallium Nitride (GaN) technology to its multi-chip module platform. Building on the company’s investment in its GaN fab in Arizona, the most advanced fab dedicated to RF power amplifiers in the United States, NXP is the first to announce RF solutions for 5G massive MIMO that combine the high efficiency of GaN with the compactness of multi-chip modules.

  9. Qualcomm Unveils Industry’s First Release 16 5G Open RAN Platform For Small Cells 6/28/2021

    Qualcomm Technologies, Inc. today announced its second-generation Qualcomm 5G RAN Platform for Small Cells (FSM200xx), the industry’s first 3GPP Release 16 5G Open RAN platform. The new platform brings major enhancements to RF with its support for all commercial global mmWave and Sub-6 GHz bands, including the new n259 (41 GHz), n258(26 GHz) and FDD bands.

  10. Fibocom Launches 5G Module Series FG130 And FM130 Powered By Qualcomm 315 5G IoT Modem-RF System To Advance 5G Deployment In IoT 6/25/2021

    Fibocom, a leading global provider of IoT (Internet of Things) wireless solution and wireless communication modules, launches its 5G wireless modules FG130 and FM130. The new 5G module series is powered by the Qualcomm 315 5G IoT Modem-RF System, aiming to advance the deployment of 5G in the IoT vertical industries and expand the new market opportunities of 5G technology in the IoT sector.