Latest Headlines
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Nordic Semiconductor's nRF9151 Cellular IoT Module Validated For Use On NTT DOCOMO's LTE-M Network In Japan
5/26/2025
Nordic Semiconductor, a global leader in low power wireless connectivity solutions, has announced that its nRF9151 low power module for advanced cellular IoT is successfully validated for use on NTT DOCOMO, Japan’s largest cellular network.
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Tongyu Communication Showcases Integrated Satellite Communication Solutions At 2025 SATEXPO, Empowering Global Connectivity
5/23/2025
Tongyu Communication (Stock Code: 002792), a leader in wireless technology, showcased its integrated satellite communication solutions at the 2025 SATEXPO, the top global exhibition for satellite technology.
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O-RAN Digital Twin Platform Co-Funded By O-RAN ALLIANCE Powers Research And Innovation In AI And Open RAN
5/22/2025
The O-RAN ALLIANCE and the Institute for the Wireless Internet of Things at Northeastern University have successfully concluded the seed funding initiative, launched by O-RAN ALLIANCE in November 2023 to support research and development of next generation open Radio Access Network (RAN) infrastructure.
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GCT Semiconductor And Giesecke+Devrient Partner To Launch Innovative eSIM Solution For IoT Devices
5/22/2025
GCT Semiconductor Holding Inc. (“GCT”), a leading designer and supplier of advanced 4G and 5G semiconductor solutions, and Giesecke+Devrient (G+D), a global provider of eSIM technology and developer of the first GSMA SGP.32 fully-certified product, today announced their partnership to launch a cutting-edge SGP.32 eSIM solution with Integrated Profile Activation Device (IPAd) support for multi-network IoT devices.
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Boost Mobile Rated No. 1 In 5G Coverage And 5G Availability Across Seven Major U.S. Cities
5/22/2025
Boost Mobile is setting a new benchmark for 5G performance. According to an independent report from Opensignal – the leading global provider of independent insights into consumers' connectivity experiences – Boost Mobile rated #1 in 5G coverage and 5G availability in seven major U.S. cities.
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Silicon Labs Unveils First Series 3 SoCs, Powering The Next Wave Of IoT Breakthroughs
5/22/2025
Silicon Labs, the leading innovator in low-power wireless solutions, today announced the first products of its Series 3 portfolio with the introduction of two new wireless SoC families built at the advanced 22 nanometer (nm) process node: the SiXG301 and SiXG302.
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EnSilica Expands Satcoms User Terminal Portfolio With Dual-Beam, Dual-Polarization Ku-band Analogue Beamformer Chipset
5/21/2025
EnSilica, a leading maker of mixed-signal ASICs, has announced two Ku-band beamformer integrated circuits, the ENS92051 and ENS92052, which offer best-in-class power consumption and performance.
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u-blox Launches First Triple-Band GNSS Module For Fast-Scaling Robotics
5/20/2025
u-blox , a global leader in positioning and short-range communication technologies for automotive, industrial and consumer markets, today expanded its ZED form-factor portfolio with the launch of the ZED-F20P, a new L1/L2/L5 triple-band GNSS module designed for high precision applications in ground and air robotics.
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LitePoint And Pegatron 5G Successfully Launch Volume Manufacturing Of 5G O-RAN Radio Units To Power Private 5G Networks
5/20/2025
LitePoint, a leading provider of wireless test solutions, and Pegatron 5G, a leading provider of end-to-end 5G product solutions, have jointly announced a milestone in their collaboration; the start of high-volume manufacturing for 5G O-RAN radio units.
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ARDRONIS Wi-Fi: The Future Of Drone Detection And Mitigation
5/20/2025
Rohde & Schwarz today announced the launch of the next generation of ARDRONIS Wi-Fi, a cutting-edge system for detecting, locating, and mitigating Wi-Fi-controlled drones.