Latest Headlines
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Sivers Semiconductors Wins A Major Chip Development Program With Leading Tier-1 Telecom Infrastructure Vendor
1/8/2025
Today, Sivers Semiconductors announced that it has been awarded a major chip development program by a leading Tier-1 telecom infrastructure vendor.
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Quectel Expands Its Short-Range Module Portfolio With Additional Wi-Fi 7, Wi-Fi 6, Wi-Fi HaLow And Bluetooth Options
1/7/2025
Quectel Wireless Solutions, a global IoT solutions provider, has unveiled five new short-range modules at CES in Las Vegas, USA. Designed to give developers and designers the broad range of options as they create innovative devices and applications for the market, the modules include the FGM840R standalone Wi-Fi and Bluetooth Combo module, the high-power Wi-Fi HaLow FGH100M-H, the Wi-Fi 6 and Bluetooth 5.4 FCS962N-LP, the Wi-Fi7 and Bluetooth 5.4 FME170Q-865, and finally the Wi-Fi6 and Bluetooth 5.3 FCU865R.
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Saelig Introduces Elite RF DAx/DBx RF Amplifiers For EMC Testing Applications
1/7/2025
Saelig Company, Inc. has introduced the Elite RF DAx and DBx Amplifiers for generating the high electromagnetic fields that are required for immunity and compatibility compliance testing.
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New 1.0mm Test Cable Assemblies A Good Fit For High-Frequency, High-Precision Applications
1/7/2025
Pasternack, an Infinite Electronics brand and a leading provider of RF, microwave and millimeter-wave products, has announced the launch of its new 1.0mm test cable assemblies.
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Telit Cinterion ME310M1-W1 IoT Module Unlocks Global Deployment Opportunities For Next-Generation Cellular LPWA Solutions
1/6/2025
Telit Cinterion, an end-to-end IoT solutions enabler, receives approval for the ME310M1-W1 module by two major U.S. MNOs. The certifications enable IoT specialists and their customers to begin using the ME310M1-W1 immediately — not only in the United States but also worldwide — thanks to its comprehensive global band support.
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Haila Technologies Releases Extreme Low-Power Development Platform For Wi-Fi Communications
1/6/2025
HaiLa Technologies, a supplier of advanced low power wireless semiconductor solutions, today introduced a new development platform to better support developers and researchers in creating extremely low power connected solutions.
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InnoPhase IoT Unveils Talaria 6 Family Of SoCs Featuring Wi-Fi 6, Multi-Protocol Connectivity And Enhanced Cybersecurity
1/6/2025
InnoPhase IoT, Inc., a leading wireless semiconductor platform company focused on elevating the IoT user experience based on ultra-low power Wi-Fi, announced the expansion of its Talaria platform with the introduction of the Talaria 6 Family of System-on-Chips (SoCs).
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AI Slashes Cost And Time For Chip Design, But That Is Not All
1/6/2025
Now, researchers at Princeton Engineering and the Indian Institute of Technology have harnessed artificial intelligence to take a key step toward slashing the time and cost of designing new wireless chips and discovering new functionalities to meet expanding demands for better wireless speed and performance.
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Vishay Expands Frequency Control Portfolio With New Surface-Mount Crystals And Oscillators
1/6/2025
To simplify the sourcing process for its customers, Vishay Intertechnology, Inc. today announced that the company's Inductors Division has expanded its frequency control line with new surface-mount crystals and oscillators designed to deliver smaller packages, wider value ranges, and improved performance — all while reducing costs.
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WiSA Association Announces Groundbreaking Innovations For Wireless Audio At CES 2025
1/6/2025
WiSA Association, a subsidiary of WiSA Technologies, Inc. (“WiSA Technologies,” “WiSA” or the “Company”), which anticipates closing its acquisition of Datavault intellectual property and information technology assets of privately held Data Vault Holdings Inc.