Latest Headlines
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Quectel Expands Combo Antenna Portfolio With Rugged Multi-Network Solutions For Demanding IoT Deployments
6/25/2026
Quectel Wireless Solutions, a global end-to-end IoT solutions provider, has expanded its external antenna portfolio with four new combo antennas designed to simplify deployment of connected devices across smart cities, fleet management, industrial automation, utilities, public safety and transport applications.
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STMicroelectronics Unveils World's First ST54M Secure Mobile Chip With Post-Quantum Cryptography For Next-Generation Connected Services
6/24/2026
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced the ST54M, a secure mobile chip designed to help smartphone and personal electronics manufacturers meet upcoming quantum-ready security requirements while supporting a seamless user experience across connected services.
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Quectel Introduces NXP Based FCM365X Wi-Fi 6, Bluetooth LE 5.4, Zigbee, And Thread Module For Smart Home And Industrial IoT Solutions
6/24/2026
Quectel Wireless Solutions, a global end-to-end IoT solutions provider, today announces the launch of the FCM365X, a dual-band Wi-Fi 6 and Bluetooth Low Energy (BLE) 5.4 module that is based on the NXP Semiconductors RW612 wireless MCU and supports multiple protocols, including Zigbee and Thread.
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New Millimeter-Wave Transceiver Doubles Spectrum Efficiency For Beyond 5G/6G Applications
6/24/2026
A newly developed architecture for full-duplex wireless transceivers solves the long-standing problem of self-interference, as reported by researchers from Science Tokyo.
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GCT Semiconductor Announces Strategic Commitment To Powering The AI-Edge Data Pipeline
6/23/2026
GCT Semiconductor Holding, Inc. (“GCT”), a leading designer and supplier of 5G semiconductors powering the AI data pipeline with wireless connectivity, today announced a strengthened strategic focus on enabling the global expansion of artificial intelligence (AI) infrastructure.
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RANsemi And TechPhosis Enable 5G OCUDU For Integrated Small Cells
6/23/2026
RANsemi Limited, the British semiconductor innovator pioneering Open RAN baseband System-on-Chip (SoC) platforms for 5G networks, and TechPhosis Private Limited, one of India’s leading 5G CU/DU stack solution providers and Open RAN integration specialists, have integrated the Linux Foundation’s open source 5G OCUDU CU/DU software stack with the RANsemi RNS802 baseband PHY using the Small Cell Forum (SCF) FAPI interface.
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Iridium's Next Generation Hybrid IoT Module And Development Kit Are Now Commercially Available
6/23/2026
Iridium Communications Inc. (Nasdaq: IRDM), a leading provider of global voice, data, and positioning, navigation, and timing (PNT) satellite services, today announced commercial availability of the Iridium® 9604 module and Development Kit, giving developers, OEMs, and solution providers a faster path to build and scale connected IoT solutions worldwide.
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GlobalFoundries Qualifies SLATE™ Advanced Packaging Technology On 9SW Platform For Next-Generation Radio Frequency Applications
6/23/2026
GlobalFoundries (Nasdaq: GFS) (GF) today announced the production readiness of its SLATE™ wafer-to-wafer bonding technology on its industry-leading 9SW radio-frequency silicon-on-insulator (RF-SOI) platform, delivering advanced 3D integration (3DI) for compact, high-performance cellular front-ends. Manufactured at GF’s 300mm facility in Singapore, 9SW SLATE technology is expected to ramp to volume production by the second half of 2027.
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HooRii Tech Launches HRR53 And HRR54 Modules: Cost-Effective Solutions For Matter Over Thread Devices
6/18/2026
HooRii Technology ("HooRii Tech") today introduced two affordable Matter over Thread modules, the HRR53 and HRR54. Both support Matter 1.5 and later, as well as Thread 1.4 and future versions, targeting always-powered Matter devices or applications with moderate low-power demands.
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Aperture-Tuning Antenna Keeps 5G Signals Strong Across Wider Frequencies
6/18/2026
A compact aperture-adjustable antenna developed by researchers at Science Tokyo could improve high-speed wireless communication across the wide 5G millimeter-wave frequency bands without increasing power consumption.