Integrated Device Technology, Inc. (IDT), a wholly owned subsidiary of Renesas Electronics Corporation, recently announced sampling of the P9415 receiver and P9247 transmitter that work together to enable smartphones to charge wirelessly with up to 30W of power, narrowing the charging time gap between wireless and wired charging options.
Ericsson and Telstra have successfully completed Australia’s first end-to-end 5G SA (stand-alone) call at Telstra’s 5G Innovation Centre on the Gold Coast Australia, accelerating efforts on the 5G evolution path.
Laird Connectivity, a global leader in wireless technology, has announced the new BL654 PA (Power Amplified) series which delivers more power and range performance in a single Bluetooth solution than ever before.
Amkor Technology, Inc., a leading provider of outsourced semiconductor assembly and test (OSAT) services, is paving the way for 5G mmWave antenna-in-package (AiP) technology.
Murata Manufacturing Co., Ltd. (head office: Nagaokakyo-shi, Kyoto; Chairman of the Board and President: Tsuneo Murata) has released the BLF03VK Series of compact (0.6 x 0.3mm) noise filters specifically designed for the 5GHz band, one of the frequency ranges used in Wi-Fi (wireless LAN) communications, for the first time in the world*.
Skyworks Solutions, Inc, an innovator of high performance analog semiconductors connecting people, places and things, recently launched a broad range of advanced, proprietary solutions optimized for next generation 5G wireless infrastructure applications.
SteppIR Communication Systems, a global provider of EMC testing equipment, today announced at EMC+SIPI 2019 Conference in New Orleans, Louisiana, the launch of the company’s new SY3-EMC EMC testing system.
At the final review of the Celtic-Plus project “ReICOvAir – Reliable Industrial Communication Over the Air” the project team, led by the Fraunhofer Institute for Integrated Circuits IIS, presented a new test system for industrial wireless communication.
Nordic Semiconductor recently announces that Globalstar, a Covington, Louisiana-based satellite and commercial IoT communications company, has selected Nordic’s award-winning Bluetooth Low Energy (Bluetooth LE) nRF52832 System-on-Chip (SoC) to provide the Bluetooth LE wireless connectivity for its ‘STX3 Development Kit’.
Researchers from Valencia’s Polytechnic University propose a new design for antennas that are located inside chips, which include all the benefits of silicon photonics and plasmonics.
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