Supplier News
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Giga-tronics And CAP Wireless To Exhibit At The EMC Symposium
8/5/2008
Giga-tronics will join CAP Wireless to exhibit at the EMC Symposium at Booth #249. The 2008 IEEE International Symposium on Electromagnetic Compatibility will be held from Monday, August 18 through Thursday, August 22 at the Cobo Center in Detroit, Michigan
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Gore Invests More In The Semiconductor Equipment Industry
7/15/2008
Gore has now doubled its manufacturing capacity for flat cables to keep pace with customer demand for cables capable of reducing particles and outgassing in semiconductor manufacturing.
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A Dash Of Maxwell's -- Chapter II -- Why Things Radiate
7/7/2008
As part of our ongoing Technology 101 coverage, RF Globalnet is presenting the historic six-part article series on Maxwell's equations by Dr. Glen Dash. Written specifically for the Web, these articles are intended to serve as a primer on electromagnetic field theory. This second article details why things radiate. Additional installments will be featured in upcoming editions of RF Globalnet newsletter
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Gore Introduces Online Builder For Specifying Ultra High Density Interconnects
6/27/2008
W. L. Gore & Associates (Gore) introduced an online builder for configuring GORE Ultra High Density (UHD) Interconnects to use in bench-top test systems, instrument probe cable, parallel data link, production floor equipment, and automated test equipment
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M/A-COM Presents Monolithic, 1000 Watt SPDT Switch Paper At MTT-S 2008
6/27/2008
Tyco Electronics M/A-COM recently announced that Tim Boles presented his "A Monolithic, 1000 watt SPDT Switch" research paper at the 2008 International Microwave Symposium (IMS) IEEE-MTT
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Acceleration Software Company Brings New Era Of Technology To Advanced RF/Microwave Design
6/20/2008
Time is critical in the design and production process. The demand is growing stronger for a significantly faster, alternative to the time consuming simulations required to complete a product design. This increased demand has forced RF design engineers to look beyond their design flow and envision the bigger picture when it comes to delivering products to market
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Intel And Micron First To Deliver Sub-40 Nanometer NAND Flash Memory Device
6/2/2008
Recently Intel Corporation and Micron Technology, Inc. introduced the industry’s first sub-40 nanometer (nm) NAND memory device, unveiling a 34nm 32 gigabit (Gb) multi-level cell chip. This process technology was jointly developed by Intel and Micron and manufactured by the companies’ NAND flash joint venture, IM Flash Technologies (IMFT).
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BVS Releases WiMAX Tablet At WiMAX World EMEA In Germany
5/16/2008
Berkeley Varitronics Systems, Inc. recently unveiled the latest WiMAX drive-study tool at the 2008 WiMAX World EMEA show (booth 614) in Munich, Germany
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Wireless Telecom Group Announces Expansion Of Boonton Power Meter Family
5/11/2008
Wireless Telecom Group, Inc. recently announced a new series of Boonton Peak Power Meters, designed for high-volume industrial and military applications typical of the mainstream peak power meter market
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Gore Improves Its Direct Air Cooling Filter For Electronic Enclosures
4/23/2008
W. L. Gore & Associates, Inc., has introduced a new membrane media for its line of GORE Cooling Filters that increases thermal performance while providing strong environmental protection and reliability.