This article will compare the performance of diode-based RF and microwave with integrated circuit alternatives. Topics covered will include transfer function linearity, temperature stability, and ADC interfacing.
Industry 4.0 is driving change in many technologies and one such change is industrial communication. New application scenarios shaped by the fourth industrial revolution demand faster, more reliable, and more accurate ultralow latency data transmission between rotating parts of automation equipment operating in real time.
Industry-leading frequency coverage and phase noise performance coupled with high output power and low power dissipation in a small form factor combine on the ADF5610 to address the stringent demands of new communication and instrumentation systems.
In the quest for higher data rates to support a variety of wireless services and different transmission schemes, system designers face higher circuit complexity but must meet similar budgets for size, power, and cost.
Massive MIMO systems will continue to evolve and there will be further need for even higher levels of integration. ADI’s new high power silicon switch technology is well suited for multichip module (MCM) designs to integrate with LNAs to offer a complete, single-chip solution for TDD receiver front ends.
Measurement and control of radio frequency (RF) power is a critical consideration when designing a wireless transmitter. High power RF power amplifiers (PAs) rarely operate in open-loop mode (that is, when the power to the antenna is not in some way monitored).