Business Wire

  1. Qualcomm And IMEC Collaborate On 3D Integration Research 7/14/2008
    IMEC and Qualcomm Incorporated announced that Qualcomm is the first fabless integrated circuit company to participate in IMEC’s industrial affiliation program (IIAP) on three-dimensional (3D) integration.
  2. Global Semiconductor Alliance Announces Release Of Analog/Mixed-Signal/Radio Frequency Process Checklist Version 1.0 7/14/2008
    Global Semiconductor Alliance (GSA) announces the release of its Analog/Mixed-Signal/Radio Frequency (AMS/RF) Process Checklist Version 1.0. The tool was developed by the GSA MS/RF Subcommittee’s Process Control Monitoring (PCM)/Process Checklist Working Group.