Business Wire

  1. Quectel's FGH200M Wi-Fi HaLow Module, Built On Morse Micro's MM8108, Now FCC/IC/CE/RCM Certified For Mass Production 7/30/2026

    Morse Micro, the world’s leading Wi-Fi HaLow silicon provider, today announced that Quectel's FGH200M module has passed FCC/IC/CE/RCM certification. Built on Morse Micro's MM8108 system-on-chip, the module is now cleared for mass-market production, giving IoT device makers a validated path to Wi-Fi HaLow at scale.

  2. Quectel Launches High-Performance FCM665D Module For Edge AI Applications 7/29/2026

    Quectel Wireless Solutions, a global end-to-end IoT solutions provider, today announces the launch of the FCM665D, a high-performance Wi-Fi 6 and Bluetooth module with edge AI processing capabilities, designed for smart home, smart building and industrial IoT devices.

  3. Digi International Adds Open-Standard SMARC Form Factor To The Digi ConnectCore 95 Family, Now Shipping Globally 7/1/2026

    Digi International, a leading global provider of Internet of Things (IoT) connectivity products and services, today announced global availability of the Digi ConnectCore 95 SMARC system-on-module (SOM) Development Kit.

  4. Keysight And WIN Semiconductors Collaborate To Cut Design Risk For High Frequency RF Components 6/30/2026

    Keysight Technologies, Inc. and WIN Semiconductors Corp. today announced a joint MMIC design workflow that enables GaN MMIC design houses to achieve first pass tapeout success.

  5. Quectel Expands Combo Antenna Portfolio With Rugged Multi-Network Solutions For Demanding IoT Deployments 6/25/2026

    Quectel Wireless Solutions, a global end-to-end IoT solutions provider, has expanded its external antenna portfolio with four new combo antennas designed to simplify deployment of connected devices across smart cities, fleet management, industrial automation, utilities, public safety and transport applications.

  6. GCT Semiconductor Announces Strategic Commitment To Powering The AI-Edge Data Pipeline 6/23/2026

    GCT Semiconductor Holding, Inc. (“GCT”), a leading designer and supplier of 5G semiconductors powering the AI data pipeline with wireless connectivity, today announced a strengthened strategic focus on enabling the global expansion of artificial intelligence (AI) infrastructure.

  7. Morse Micro Welcomes VPI Technology To Wi-Fi HaLow Design Partner Program 6/15/2026

    InfoComm 2026 — Morse Micro, the world’s leading Wi-Fi HaLow silicon provider, today announced VPI Technology has joined its Design Partner Program, bringing its full-stack Wi-Fi HaLow design and manufacturing expertise.

  8. Semtech's Design Partner Program Accelerates IoT Solutions To Market 9/11/2018

    Semtech Corporation, a leading supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, recently announced the Semtech Design Partner Program.

  9. Mitsubishi Electric Develops 28GHz Massive-Element Antenna And RF Module For 5G Base Stations 4/17/2017

    Mitsubishi Electric Corporation has developed a compact massive-element antenna and RF module that achieves a wide 800MHz bandwidth and wide-angle beamforming for 28GHz communications in fifth-generation (5G) radio base stations.

  10. Analog Devices Expands GaN Power Amplifier Portfolio With Two Broadband 6-GHz Modules 4/6/2017

    Analog Devices, Inc. recently announced a pair of high-performance gallium nitride (GaN) power amplifier (PA) modules which offer one of the highest power-density levels in their class, thus minimizing size and weight of the subsystem.