Business Wire

  1. Digi International Adds Open-Standard SMARC Form Factor To The Digi ConnectCore 95 Family, Now Shipping Globally 7/1/2026

    Digi International, a leading global provider of Internet of Things (IoT) connectivity products and services, today announced global availability of the Digi ConnectCore 95 SMARC system-on-module (SOM) Development Kit.

  2. Keysight And WIN Semiconductors Collaborate To Cut Design Risk For High Frequency RF Components 6/30/2026

    Keysight Technologies, Inc. and WIN Semiconductors Corp. today announced a joint MMIC design workflow that enables GaN MMIC design houses to achieve first pass tapeout success.

  3. Quectel Expands Combo Antenna Portfolio With Rugged Multi-Network Solutions For Demanding IoT Deployments 6/25/2026

    Quectel Wireless Solutions, a global end-to-end IoT solutions provider, has expanded its external antenna portfolio with four new combo antennas designed to simplify deployment of connected devices across smart cities, fleet management, industrial automation, utilities, public safety and transport applications.

  4. GCT Semiconductor Announces Strategic Commitment To Powering The AI-Edge Data Pipeline 6/23/2026

    GCT Semiconductor Holding, Inc. (“GCT”), a leading designer and supplier of 5G semiconductors powering the AI data pipeline with wireless connectivity, today announced a strengthened strategic focus on enabling the global expansion of artificial intelligence (AI) infrastructure.

  5. Morse Micro Welcomes VPI Technology To Wi-Fi HaLow Design Partner Program 6/15/2026

    InfoComm 2026 — Morse Micro, the world’s leading Wi-Fi HaLow silicon provider, today announced VPI Technology has joined its Design Partner Program, bringing its full-stack Wi-Fi HaLow design and manufacturing expertise.

  6. MathWorks Highlights RF Digital Twin Workflows For Radar And Satellite Communications At IMS 2026 6/8/2026

    IMS 2026: Booth # 18090 – MathWorks, the leading developer of mathematical computing software for designing engineered systems, will highlight a digital twin capability at the International Microwave Symposium (IMS) 2026.

  7. Morse Micro Announces MM8108-M20 High-Power Wi-Fi HaLow Module To Accelerate Long-Range IoT Adoption 6/1/2026

    Morse Micro, the world’s leading Wi-Fi HaLow silicon provider, today announced the MM8108-M20, a high-power Wi-Fi HaLow module designed to help product teams in the US and Canada bring long-range, low-power Wi-Fi HaLow devices to market faster.

  8. Keysight To Showcase Spectrum Innovations At IMS 2026 5/26/2026

    What: At the 2026 IEEE MTT-S International Microwave Symposium (IMS), Keysight Technologies will showcase solutions that help engineers accelerate spectrum utilization by solving complex RF design, emulation, and validation challenges.

  9. NextNav Joins OCUDU Ecosystem Foundation To Advance Open Source 5G And 6G Integrated Sensing And PNT 5/14/2026

    NextNav Inc., a leader in next-generation terrestrial positioning, navigation, and timing (PNT) and 3D geolocation solutions, today announced it has joined the OCUDU Ecosystem Foundation, a collaborative initiative hosted by the Linux Foundation to advance open, secure, and interoperable Open RAN centralized unit and distributed unit (CU/DU) implementations.

  10. GCT Semiconductor Signs Reference Platform Contract With Major Satellite Communications Provider To Fast-Track Global 5G Deployment 5/7/2026

    GCT Semiconductor Holding Inc. (“GCT” or the "Company") (NYSE: GCTS), a leading designer and supplier of advanced 5G and 4G semiconductor solutions, today announced it has signed a reference platform agreement with one of the world’s largest satellite communications providers, supplementing a 5G/4G Chipset Licensing agreement executed in January.