Latest Headlines

  1. Ericsson Supplies RAN Compute Platform For NTT DOCOMO In Japan 7/31/2026

    Ericsson’s next-generation RAN Compute platform has been selected by NTT DOCOMO, INC. (DOCOMO) for its networks in Japan, including 5G.

  2. Quectel Launches FCE870X And FME170X Tri-Band Wi-Fi 7 Modules With Bluetooth 6.0 For Set-Top Boxes, Gaming Devices, And More 7/30/2026

    Quectel Wireless Solutions, a global end-to-end IoT solutions provider, today announces the launch of the FCE870X and FME170X tri-band Wi-Fi 7 modules, powered by the Synaptics SYN4384 chipset and designed for set-top boxes, gaming devices, digital signage, VR/AR headsets, smart gateways, and other high-performance connected products.

  3. Bourns Releases LTCC Low Pass Filters For Wireless Communication Applications Covering DC To 3800 MHz 7/30/2026

    Bourns today announced the release of the Model FLP1004N089D4, FLP1606N078D6, FLP1606N355D6, FLP1608N250D6, FLP2009N025D8, FLP2009N086D8, FLP2009N091D8, FLP2009N092D8, and FLP2009N141L3 LTCC (low-temperature co-fired ceramic) low pass filters, a family of nine models designed to address size constraints and frequency-selective filtering requirements in wireless communication designs.

  4. Quectel's FGH200M Wi-Fi HaLow Module, Built On Morse Micro's MM8108, Now FCC/IC/CE/RCM Certified For Mass Production 7/30/2026

    Morse Micro, the world’s leading Wi-Fi HaLow silicon provider, today announced that Quectel's FGH200M module has passed FCC/IC/CE/RCM certification. Built on Morse Micro's MM8108 system-on-chip, the module is now cleared for mass-market production, giving IoT device makers a validated path to Wi-Fi HaLow at scale.

  5. AEWIN Launched Ultra-Compact Fanless Network Appliance, SCB-6917 And SCB-6918 7/29/2026

    AEWIN proudly introduces the SCB-6917 and SCB-6918, compact fanless desktop network appliances powered by the Intel Atom X7203C/X7405C processor (codenamed Amston Lake-C).

  6. Fibocom LTE Cat.1 bis Module Receives KDDI Certification, Accelerating IoT Device Development And Deployment In Japan 7/29/2026

    Fibocom's LTE Cat.1 bis wireless communication module MG661-JP has received certification from KDDI, one of Japan's leading telecom operators.

  7. Quectel Launches High-Performance FCM665D Module For Edge AI Applications 7/29/2026

    Quectel Wireless Solutions, a global end-to-end IoT solutions provider, today announces the launch of the FCM665D, a high-performance Wi-Fi 6 and Bluetooth module with edge AI processing capabilities, designed for smart home, smart building and industrial IoT devices.

  8. Bourns LTCC Band Pass Filter – Balanced Type Integrates Balun And Impedance Matching For Sub GHz IoT RF Front Ends 7/28/2026

    Bourns today announced the Model FBD1608N080D6 LTCC (Low-Temperature Co-fired Ceramic) band pass filter - balanced type, a sub‑GHz RF filter‑integrated balun designed for wireless communication applications.

  9. ZTE And XLSMART Deepen Strategic Collaboration To Advance AI-Powered 5G And FWA In Indonesia 7/28/2026

    ZTE Corporation, a global leading provider of integrated information and communication technology solutions, has signed a Memorandum of Understanding (MoU) with PT XLSMART Telecom Sejahtera Tbk (XLSMART) during MWC Shanghai 2026.

  10. Telespazio Inaugurates A New S/X-Band Satellite Antenna In The Azores, Expanding Its International Network Of Ground Stations 7/28/2026

    Telespazio, a Leonardo Group company, has successfully completed the installation of a new proprietary S/X-band satellite antenna on the island of Santa Maria, in the Portuguese archipelago of the Azores (Atlantic Ocean).