VLSI Ships Chip-Scale Packaging Optimized For Wireless, Portable Markets

VLSI Technology is shipping semiconductors in a fine-pitched ball-grid array (BGA) chip-scale package (CSP). Products housed in this package will be employed in cellular phones, personal digital assistants (PDAs), pagers, and global positioning system (GPS) terminals.

VLSI's new 100-to-280-pin FPBGA package family uses a chip-up, wirebonded configuration with a flexible tape circuit substrate that is over-molded. The package features a 0.8 mm ball pitch and a 0.48 mm ball size.

VLSI is currently using the new chip-scale packaging in several of its wireless standard products. These include the OneC GSM platform and the single-chip CDMA+ dual-core baseband solution.

In the second quarter of 1999, VLSI plans to introduce a smaller version of its new FPBGA package. This upgraded package will offer a 0.5 mm ball pitch and will provide an approximate 80 percent reduction over LQFP technology.