TSMC Offers 0.18-µm Process Technology
Taiwan Semiconductor Manufacturing Co. is releasing its CL018 0.18-µm CMOS process technology. The single-poly, six-metal layer process, with low-k dielectric is among the first commercially available 0.18-µm processes. TSMC is already shipping products based on CL018 to customers.
TSMC's CL018 is a process technology platform for system-on-chip products. Building on the 1.8V logic foundation, customers can add 2.5V and 3.3V transistors for mixed-signal cores and I/O; precision capacitors and resistors for high-performance mixed-signal functions; and high-quality inductors, varactors, and diodes for RF functions. In 2000, TSMC will add Embedded DRAM and Embedded Flash Memory modules to the process.
TSMC also unveiled its latest design rules, which allow densities of over 100,000 gates/mm2 and an SRAM cell size of only 4.65 square µs. The performance of the process allows logic speeds over 400 MHz and on-chip memory speeds over 500 MHz. Power gate dissipation, with a 1.8V supply, is less than 30 nW/MHz.
The process technology has been designed to offer a combination of density, speed and power to serve a range of computing, communications, and consumer applications. Early applications include high-performance 3D graphics chips for PCs, next-generation digital set-top boxes, high-capacity programmable logic devices, and chips for advanced wireless products.
TSMC also announced the availability of library support for its 0.18-µm CMOS process technology. Through third parties, TSMC customers have access to a complete line of libraries including core cells, memory compilers and I/O cells.
Current TSMC partners offering 0.18-µ libraries include Artisan Components, Avant!, Nurlogic, Synopsys, Virage Logic, and Virtual Silicon. First test chips have been completed in most cases.