Substrate-Noise Analyzer

SubstrateStorm 3.1 is a substrate-noise modeling and analysis tool, featuring a 100X speed-up in extraction time and a 10X increase in throughput capacity. This version of SubstrateStorm includes expanded modeling for advanced process features, enableing wireless chipset designers to integrate onto a single chip.

Substrate-noise coupling has become a primary issue for designers of deep-submicron (DSM) mixed-signal, analog, wireless -- including radio-frequency (RF) and Bluetooth -- and high-speed digital integrated circuits (ICs). The inability to verify the effects of substrate noise on sensitive analog circuitry has been a significant factor limiting the integration of greater mixed-signal functionality on a single die for applications such as wireless communications. SubstrateStorm 3.1 breaks through the noise barrier to integration by enabling designers to analyze the substrate coupling effects on even the most advanced semiconductor processes.

SubstrateStorm models the substrate of complex chips fabricated in any advanced technology and then produces intuitive, graphical output that designers can use to interactively analyze the noise coupling across the substrate of their chip. SubstrateStorm 3.1's speed, capacity and support for advanced processes, such as triple-well, silicon-on-insulator (SOI), buried layers and deep trenches, enables designers to put more complexity and functionality on a single die.

Simplex Solutions, Inc., 521 Almanor Avenue, Sunnyvale, CA 94086. Tel: 408-617-6100; Fax: 408-774-0285.