Top- and bottom-accessibility increases mounting and heatsinking design agility
Richardson RFPD, Inc. announced recently the availability and full design support capabilities for a new 10 W hybrid GaN module from MACOM Technology Solutions Inc.
The MAMG-100227-010 is a broadband, two-stage GaN-on-Si hybrid power amplifier module in an air-cavity laminate package. The 10 W device is fully-matched and covers wide 225–2600 MHz frequency range.
A gold-plated copper heat sink is attached to the bottom side of the laminate substrate. The package can be accessed from the top or the bottom allowing for “live bug” or “dead bug” mounting. This mounting flexibility enables streamlined designs for smaller, lighter radios.
The new module is ideal for use in tactical military communications, LMR, and wireless (public safety) markets.
Additional key features of the MAMG-100227-010 include:
To find more information, or to purchase this product today online, please visit the MAMG100227-010 webpage. Please find a local sales engineer (worldwide) at Local Sales Support. To learn about additional products from MACOM, please visit the MACOM storefront webpage.
About Richardson RFPD
Richardson RFPD, an Arrow Electronics company, is a global leader in the RF, wireless, IoT and power technologies markets. It brings relationships with many of the industry’s top radio frequency and power component suppliers. Whether it’s designing components or engineering complete solutions, Richardson RFPD’s worldwide design centers and technical sales team provide comprehensive support for customers’ go-to-market strategy, from prototype to production. For more information, visit www.richardsonrfpd.com.
SOURCE: Richardson RFPD, Inc.