MTT-S 2007: Peregrine Announces RFICs Now Utilize Advanced Chip Scale Packaging

Honolulu -- IEEE MTT-S International Microwave Symposium -- Peregrine Semiconductor Corporation has advanced its RF switch line for quad-band GSM and GSM/WCDMA handset applications by introducing RFICs utilizing advanced chip scale packaging. The HaRP-enhanced PE42632 SP6T and the PE42674 SP7T flip-chip devices enable 40% size reduction in front end modules by eliminating the area consumed by wire bonds.

Peregrine claims the PE42674 is the world's first flip-chip monolithic SP7T WEDGE switch with on-board CMOS decoder. It offers one WEDGE-compliant port (TX1), two GSM/EDGE TX ports, and four RX ports. The device offers exceptional linearity (2fo of -85 dBc and 3fo of -79 dBc); IIP3 of +67 dBm; TX-RX isolation of 38.5 dB (900 MHz); 0.65 dB insertion loss (900 MHz); and IMD3 of -109 dBm.

"The robust mechanical strength of sapphire, the base substrate used for UltraCMOS, allows Peregrine to offer low-cost chip scale packaging," stated Rodd Novak, vice president of marketing and business development for Peregrine. "It enables our customers to continue to advance their product roadmaps by greatly reducing the area needed to implement the switch function as well as lowering their overall production costs," he added.

The PE42632 SP6T switch also delivers strong performance: low harmonics (2fo of -90 dBc and 3fo of -82 dBc); TX-RX Isolation of 38 dB (900 MHz) and 31 dB (1900 MHz); P1dB compression point of 41 dBm; and 0.55 dB of insertion loss at 900 MHz.

Both devices feature 1.5 KV ESD tolerance on all ports, 2.75 V operating voltage and ultra-low power consumption, while on-chip CMOS decode logic facilitates both 1.8 V and 2.75 V three-pin CMOS control inputs. No blocking capacitors and on-chip SAW filter over-voltage protection devices ensure easeof- integration.

SOURCE: Peregrine Semiconductor Corporation