Mobile Radio UMTS
Source: Infineon Technologies
The M-GOLD dual-mode UMTS/GSM baseband integrated circuit solution enables customers to develop highly integrated, miniaturized...
The M-GOLD dual-mode UMTS/GSM baseband integrated circuit solution enables customers to develop highly integrated, miniaturized and feature rich third generation wireless terminals. The chip is the first single-chip baseband solution that drives the convergence of second and third generation (2G, 3G) mobile radio standards.
The chip integrates both analog and digital functions (mixed signal design) and interfaces seamlessly with the UMTS/GSM radio frequency chipsets. The highly integrated single-chip baseband IC incorporates the company's UMTS and GSM/GPRS modems as well as an extensive set of dedicated and general purpose peripherals. Due to its dual-mode capability the chip addresses all UMTS/WCDMA and UMTS/WCDMA/GSM markets.
The chip is based on the CARMEL DSP and TriCore architectures and is manufactured in an advanced five layer metal, copper 0.18 um CMOS process. It will be available in a LFBGA 256 package.
Infineon Technologies, Wernerwerkdamm 16, Berlin, Germany 13629. Tel: +49(30)386; Fax: +49(30)38627956.
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