Avago Breaks Size Barrier With Wafer-Scale RF ICs
Avago Technologies has leveraged over thirty years of experience in RF component design to become an instrumental driver in the wireless revolution. Today, we have a broad portfolio of processes and basic technology patents for III-V semiconductors in the wireless marketplace.
Our innovative Wafer Scale Packaging (WSP), enhancementmode pHEMT, CoolPAM ™ and bulk film acoustic resonator (FBAR) technologies have set new benchmarks for component size, low power requirements and performance. Our WSP devices are fabricated in our Fort Collins, CO facility using micro-electro-mechanical systems-like (MEMS-like) techniques that result in fully functioning RFICs and filters the size of a typical 0402 SMT. Having this key technology in-house provides the additional benefit of quality control through every step of the design and manufacturing process.
A key advantage of this technology is that an air cavity is formed in each WSP device when bonding two wafers together. This enables superior broadband RF performance through the elimination of the parasitic capacitance and the dielectric loading that limits high-frequency performance in traditional plastic over-molded devices. A gasket is used to seal each device providing an effective moisture barrier without impacting performance. Another key advantage to our WSP technology is the leadless packages formed which use vias within each device to bring the connections down to the bottom allowing standard SMT equipment to mount and solder them to a PCB. As a result, no special equipment is required to take advantage of this innovative technology.
WSP provides the smallest form factor available in the market for use where size is of paramount importance within the application. A complete lineup of WSP devices are available from Avago Technologies including broadband, low noise, high linearity FETs, (Low Noise Amplifiers) LNAs, general purpose amplifiers, (Variable Gain Amplifiers) VGAs, detectors, diodes, and filters. Each device is fully matched 50 Ohm with no additional RF matching required. These can be seen in wireless handsets and infrastructure, military, Cable/ Satellite TV, automotive, radar, and test equipment.
Packaging has always been the "Achilles Heal" of extracting the maximum microwave performance out of any IC technology. Our wafer-level packaging technology provides a viable and reliable solution to future microwave through millimeter applications. The inherent parasitic capacitance and inductance associated with bond wires, lead frames, and encapsulating dielectric materials dominate the final products high frequency performance by making the IC the package.
For more information contact us at www.avagoresponsecenter.com/400
SOURCE: Avago Technologies