Datasheet | February 15, 2024

AEC-Q200 Leaded Standoff MLCC Capacitors Datasheet

Metal Frame J-Lead Terminal MLCC components offer enhanced performance under critical testing conditions, including thermal shock and mechanical vibrations. These high-reliability parts are capable of 3,000 thermal cycles with no degradation of interconnects when mounted on an FR4 board. Compared to a surface-mounted chip, lead flexibility accommodates much more board bending and flexing before internal cracks form.

In arrangements with many components clustered on a board, leaded standoffs are advantageous because they position ceramic elements off the board, ultimately providing more design flexibility. With high voltage ratings, standoffs can help control flashover across the component surface as well.

access the Datasheet!

Get unlimited access to:

Trend and Thought Leadership Articles
Case Studies & White Papers
Extensive Product Database
Members-Only Premium Content
Welcome Back! Please Log In to Continue. X

Enter your credentials below to log in. Not yet a member of Wireless Design Online? Subscribe today.

Subscribe to Wireless Design Online X

Please enter your email address and create a password to access the full content, Or log in to your account to continue.


Subscribe to Wireless Design Online

Knowles Precision Devices DLI