Business Wire
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UMC Introduces Industry’s First 3D IC Solution For RFSOI, Accelerating Innovations In The 5G Era
5/2/2024
United Microelectronics Corporation , a leading global semiconductor foundry, today announced the industry’s first 3D IC solution for RFSOI technology.
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Airgain And Mouser Electronics Sign Agreement To Supply Airgain Products To Design Engineers Globally
4/30/2024
Airgain, Inc., a leader in wireless connectivity solutions that creates and delivers integrated components, external antennas and integrated systems to every corner of the globe , announces an agreement to distribute its wireless and IoT products through Mouser Electronics, an online electronic components distributor serving the global community of electronic design engineers and buyers.
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Keysight, Synopsys, And Ansys Deliver Radio Frequency Design Migration Flow To TSMC’s N6RF+ Process Node
4/24/2024
Keysight Technologies, Inc., Synopsys, Inc., and Ansys introduce a new integrated radio frequency (RF) design migration flow from TSMC’s N16 process to its N6RF+ technology to address the power, performance, and area (PPA) requirements of today’s most demanding wireless integrated circuit applications.
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HPE Aruba Networking Introduces High-Capacity Wi-Fi 7 Access Points To Improve Enterprise Security, Address AI And IoT Challenges
4/23/2024
Hewlett Packard Enterprise today launched Wi-Fi 7 access points (APs) that provide up to 30% more capacity* for wireless traffic than competitive products.
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GigNet And IotaComm To Collaborate On Internet-Of-Things (IoT) Solutions For The Mexican Caribbean
4/22/2024
GigNet, a Digital Infrastructure company with an extensive regional fiber optic broadband network from Costa Mujeres, North of Cancun, through the Hotel Zone of Tulum, announced today a planned partnership to offer Internet of Things (IoT) solutions for the hospitality industry in the Mexican Caribbean with IotaComm, a U.S.-based provider of wireless IoT technology and services.
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Murata’s First Communication Module Supporting LoRaWAN + Satellite Communication (S-Band) ~ Helps Expand Communication Area And Streamline IoT Device Development Process ~
4/21/2024
Murata Manufacturing Co., Ltd. (hereinafter referred to as “Murata”) (Murata Manufacturing Co., Ltd., TOKYO: 6981) (ISIN: JP3914400001) has developed Murata The first (1) communication module "Type 2GT" that supports both LoRaWAN (2) and satellite communication (hereinafter referred to as "this product").
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Quectel Officially Launches Commercial 5G RedCap Module RG255C-GL, Further Enriching The RedCap Product Lineup
4/16/2024
During the 2024 German Embedded World (embedded world 2024), Quectel Communications, the world's leading IoT overall solution provider, announced that its... The 5G RedCap module RG255C-GL is officially commercialized and can provide comprehensive 5G and 4G network connections for IoT terminals at home and abroad.
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Quectel Expands Its Redcap Offering With The Commercial Availability Of The RG255C-GL RedCap 5G Module
4/9/2024
Quectel Wireless Solutions, a global IoT solutions provider, is pleased to announce the commercial availability of the RG255C-GL 5G RedCap Sub-6 GHz LGA module, providing coverage Full 5G and 4G globally. Based on Qualcomm Technologies, Inc.'s Snapdragon .
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Murata’s Multi-Band LoRa Radio Module Simplifies Wireless Design And Supply-Chain Management For IoT Device Developers
4/1/2024
Murata Manufacturing Co., Ltd. today unveiled its groundbreaking Type 2GT module, a multi-band, low-power radio (LoRa) module which marks a significant leap forward in the development of IoT devices requiring versatile wireless connectivity.
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Quectel Introduces Series Of New High-Performance 5G, GNSS And 5-In-1 combo Antennas
3/27/2024
Quectel Wireless Solutions, a global IoT solutions provider, has made further additions to its comprehensive range of antennas for IoT devices and deployments.