Rogers To Highlight Material Solutions Spanning RF To Digital At The 2012 IPC Midwest Show

Rogers Corporation will have a strong presence at the upcoming IPC Midwest Exhibition and Conference, both on the show floor and as part of the technical conference. This key industry event is scheduled for August 22-23 at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, IL. The IPC Midwest Exhibition and Conference (www.ipcmidwestshow.org) is for electronic circuit assembly and printed-circuit-board (PCB) manufacturing professionals. Representatives from Rogers Corporation will be on hand at Booth #503 to advise visitors on the optimal use of their diversified lines of circuit-board materials, engineered to extract the best performance from high-frequency analog and high-speed digital circuits.

As part of the exhibition, Rogers’ staff will be highlighting their halogen-free Theta® circuit materials, a family of laminate and prepreg products ideally suited for high-speed digital circuits. These materials have the low loss required for outstanding signal integrity in high-speed digital designs, which feature a relative dielectric constant of 3.90 at 1 GHz and low dissipation factor of 0.009 at 1 GHz for excellent low loss performance. Theta circuit materials are designed for high reliability, with a low coefficient of thermal expansion (CTE) of only 50 ppm/°C in the z direction, or about 30% less expansion than standard FR-4 circuit materials for the same temperature range. This translates into improved reliability of plated through holes (PTHs), buried blind, and stacked vias in multilayer structures requiring multiple lamination cycles. RoHS-compliant Theta laminates are available in a range of thickness options for design flexibility.

In addition, visitors to the Rogers’ booth are encouraged to ask about the new ROG Calculator App, available online at:  www.rogerscorp.com/rogcalc. This free software tool is actually four handy calculators in one simple-to-use program. It provides conversions for commonly used units of measure (such as VSWR and conversion loss), calculations of copper laminate thickness, analysis of circuit material thermal coefficient of dielectric constant (TCDk), and estimations of circuit material CTE.

On the conference side, attendees can learn more about circuit materials and lead-free processing by attending a presentation from John Coonrod, Rogers’ Market Development Engineer. He is the author of numerous articles on circuit materials as well as the popular “ROG” blog series (www.rogerscorp.com/acm). Speaking as part of an IPC Midwest Conference session on “Assembly Process Soldering Materials,” his address is entitled “New Developments in PCB Laminates, Halogen Free & Lead-Free Soldering Capable.” It is scheduled for August 23 at 10:15 – 11:45 AM as part of Session S05.

About Rogers Corporation
Rogers Corporation is a global technology leader in specialty materials and components that enable high performance and reliability of consumer electronics, power electronics, mass transit, clean technology, and telecommunications infrastructure.  With more than 180 years of materials science and process engineering knowledge, Rogers provides product designers with solutions to their most demanding challenges. Rogers’ products include advanced circuit materials for wireless infrastructure, power amplifiers, radar systems, high speed digital; power electronics for high-voltage rail traction, hybrid-electric vehicles, wind and solar power conversion; and high performance foams for sealing and energy management in smart phones, aircraft and rail interiors, automobiles and apparel; and other advanced materials for diverse markets including defense and consumer products. Headquartered in Connecticut (USA), Rogers operates manufacturing facilities in the United States, Belgium, China, Germany, and South Korea, with joint ventures and sales offices worldwide. For more information, visit www.rogerscorp.com.