MTT-S—Emerson & Cuming Unveils Free-Flowing Syntactic Foam Powder

N/A the MTT-S show in Anaheim, CA, Randolph, MA-based <%=company%>has released a one-part, free-flowing syntactic foam powder for microwave applications. The new powder, dubbed Eccostock FFP, is particularly suited for applications needing low loss, low dielectric currents, and low thermal conductivity.

To apply the foam, engineers simply pour it into a cavity and then heat it up. The epoxy-based material then cures at elevated temperatures to a rigid non-burning syntactic foam, providing physical support, thermal insulation, and vibration support without increasing weight or dielectric constant.

Eccostock FFP can be cured at temperatures as low as 100°C (212°F), or more quickly at higher temperatures. There is minimum shrinkage during cure, exerting minimum stress on delicate components. Cured material is easily removed for access to component repair or replacement. Opened areas can be refilled and cured using the original process. Since cured Eccostock FPP is porous, application of an epoxy coating will reduce moisture absorption.

Typically, the new syntactic foam delivers a 240 kg/m³ density, a 10,000 kPa comprehensive strength, and a 1.25 dielectric constant at 8.6 GHz. It also provides a 0.005 loss tangent at 8.6 GHz, a 64 V/mil dielectric strength, and a –65 to +175°C temperature range.

Eccostock FFP is available in squeeze bottles. Shelf life is six months when storing containers at 21°C (70°F) out of direct sunlight. For more information, contact Emerson & Cuming at 781-961-9800.