Current Headlines
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Morse Micro Partners With DigiKey To Expand Global Access To Wi-Fi HaLow Solutions
5/7/2026
Morse Micro, the world’s leading Wi-Fi HaLow silicon provider, today announced a distribution partnership with DigiKey, the global distribution leader of electronic components and automation products.
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Tachyon Networks Expands FWA Portfolio With $1.5M Development Partnership With Sivers Semiconductors
5/6/2026
Sivers Semiconductors AB, a global leader in photonics and wireless technologies, today announced a new $1.5M development partnership with Tachyon Networks Inc., for a 60 GHz mmWave transceiver for the FWA market.
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Fraunhofer IIS Tests High Bandwidths For Non Terrestrial Networks (NTN)
5/6/2026
In April 2026, the Fraunhofer Institute for Integrated Circuits IIS successfully demonstrated a broadband 5G NTN connection in the Ka-band frequency range via the geostationary (GEO) satellite Heinrich Hertz.
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This Algorithmic Framework Is Discovering Novel Chip Designs Never Invented Before
5/6/2026
USC researchers invent a chip design method that could accelerate the design of the next generation of wireless devices, from 5G phones to autonomous vehicles, by unlocking designs that traditional chip engineering could never reach.
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Samsung And Qualcomm Achieve Industry-First Power Class 1 Validation For 5G Fixed Wireless Access On Virtualized RAN
5/6/2026
Samsung Electronics today announced a significant advancement in Fixed Wireless Access (FWA) technology, successfully validating 5G Power Class 1 (PC1) capability through its virtualized RAN (vRAN) and the Qualcomm Dragonwing FWA Gen 4 Platform featuring the Qualcomm X85 Modem-RF chipset.
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C-COM Receives $1.35M In Antenna Orders
5/5/2026
C-COM Satellite Systems Inc., a leading global provider of commercial grade mobile auto-deploying satellite antenna systems, announced today that it has received $1.35M worth of orders for its iNetVu antenna systems.
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Ampleon Launches High-Voltage LDMOS Macro Driver Platform With Integrated Doherty MMICs For Efficient, Simplified 4G/5G Base Stations, Featuring A 2.6 GHz Flagship Driver
5/4/2026
Ampleon announces the B10H27N70D, a flagship product in its novel High-Voltage LDMOS Macro Driver platform, enabling uncompromised drive of high-power GaN-SiC transistors in macro base stations.
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Optical Antenna Allows In-Flight Communication Between Drones Using UV Light
4/30/2026
Researchers have developed a new optical antenna for wireless ultraviolet (UV) communication that captures and amplifies signals from a broad area.
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Broadcom Accelerates Multi-Gig Broadband With Optimized 10G PON And Wi-Fi 8 Solutions For Mass Market
4/30/2026
Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops, and supplies semiconductor and infrastructure software solutions, today announced its fourth wave of Wi-Fi 8 chips and an optimized 10G PON chip, solidifying its broadband industry leadership by extending the benefits of IEEE 802.11bn for service providers in hyper-competitive average revenue per user (ARPU) constrained broadband markets.
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Eliminate Magnetic Interference With MCX Connectors Designed With Non-Ferrous Materials
4/30/2026
Amphenol RF is pleased to announce the expansion of our non-magnetic MCX product series with additional coaxial connector configurations.