Current Headlines
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Saelig Introduces EECL's Rack-Mount Solid-State Full Cross-Bar Switch Matrixes For 16kHz - 12/30GHz Signals
5/12/2026
The SMX series of switch matrixes meet the precision testing requirements for creating bi-directional RF paths over a broad frequency range from 16 kHz to 12/30 GHz, maintaining minimal insertion and return loss.
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KRYTAR Announces Two (2) New ULTRA+ 90-Degree Hybrid Couplers Covering 10 To 40 GHz
5/12/2026
KRYTAR, Inc., a leader in the design and production of ultra-broadband microwave components announces two (2) new ULTRA+ 90-Degree Hybrid Couplers that deliver 3 dB of coupling over the frequency range of 10.0 to 40.0 GHz in compact packages.
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Lantronix xPico 600 Brings Wi-Fi 6, Enterprise Security And Cloud Management To Industrial IoT — All In A Single Embedded Module
5/12/2026
Lantronix Inc. (Nasdaq: LTRX), a global provider of Edge AI and Industrial IoT solutions that power NDAA-compliant unmanned systems, critical infrastructure and resilient enterprise networks, today introduced the xPico® 600 series, a production-ready family of Wi-Fi® 6 and Bluetooth® Low Energy (BLE) 5.4 embedded gateway modules that solve one of embedded IoT development’s biggest challenges: time-to-revenue.
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VOXMICRO Introduces WAVIA Architecture For Configurable Multi-Radio RF Modules At The XPONENTIAL 2026 In Detroit
5/12/2026
WAVIA is built around a configurable, multi-radio RF topology rather than a fixed-stack module pattern.
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Ceva Advances Full-Stack Wireless Vision With Next Generation Bluetooth High Data Throughput And Integrated RF Design Win
5/11/2026
Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced a major customer win for its Bluetooth® High Data Throughput (HDT) solution including Ceva's internally developed RF technology, a significant commercial milestone validating the company's strategy to expand its wireless offering and deliver comprehensive, system-level solutions to its customers.
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HFR Accelerates Development Of GPU-Based AI-RAN, A Core 6G Technology, In Collaboration With ETRI
5/8/2026
HFR, Inc. (KOSDAQ: 230240), a leading telecommunications equipment provider, announced today that it has launched the full-scale development of 'AI-RAN,' widely considered the core technology for 6G.
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ZTE And MediaTek Unveil Tri-Band Wi-Fi 7, Targeting A Relatively Unexplored Premium Niche In Brazil
5/7/2026
ZTE Corporation, a global leading provider of integrated information and communication technology solutions, and MediaTek, a global semiconductor company and leader in the smartphone processor market, unveiled a joint strategy at the 2026 ZTE Broadband User Congress.
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GCT Semiconductor Signs Reference Platform Contract With Major Satellite Communications Provider To Fast-Track Global 5G Deployment
5/7/2026
GCT Semiconductor Holding Inc. (“GCT” or the "Company") (NYSE: GCTS), a leading designer and supplier of advanced 5G and 4G semiconductor solutions, today announced it has signed a reference platform agreement with one of the world’s largest satellite communications providers, supplementing a 5G/4G Chipset Licensing agreement executed in January.
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Qualcomm OCUDU Ecosystem Foundation's Premier Membership To Accelerate Open Source Software For Open RAN Infrastructure
5/7/2026
The OCUDU Ecosystem Foundation, a collaborative initiative hosted by the Linux Foundation to advance open, secure, and interoperable Open RAN centralized unit and distributed unit (CU/DU) implementations, today announced that Qualcomm Technologies, Inc. has joined as a Premier Member.
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Rohde & Schwarz And Greenerwave Achieve Precise And Fast ESA Antenna Characterization Using Near-Field Technology
5/7/2026
A joint measurement trial, Rohde & Schwarz and Greenerwave have demonstrated that a near-field system can record a full radiation pattern of a 50 cm Ku band electronically steerable array for a SATCOM antenna in just half an hour.