Current Headlines

  1. u-blox Expands Collaboration With Nordic Semiconductor, Introducing ALMA-B2 Modules With Low-Latency Edge ML Capabilities 5/28/2026

    u-blox, a global leader in positioning and short-range communication technologies for automotive, industrial, and consumer markets, today announced the expansion of its short-range radio portfolio with new low-latency Edge Machine Learning (Edge ML) capabilities.

  2. Nordic Semiconductor Brings AI-Assisted Development To The Entire Product Lifecycle 5/28/2026

    Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, today brings AI-assisted development to all parts of the IoT device lifecycle.

  3. Qorvo Eliminates Cascaded Switches In 5G Radios With New Wideband High-Isolation Family 5/27/2026

    Qorvo, a leading global provider of connectivity and power solutions, today announced a new family of RF switches designed to simplify multi-band radio architectures.

  4. Broadcom Unveils World's First Integrated 5G And Wi-Fi 8 FWA Platform In Collaboration With Samsung Electronics 5/27/2026

    Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops, and supplies semiconductor and infrastructure software solutions, today announced its collaboration with Samsung Electronics Co., Ltd. on a new, broadband-optimized reference platform for the global fixed wireless access (FWA) market, integrating Broadcom's BCM6776 Wi-Fi 8 System-on-Chip (SoC) with Samsung's B1320 5G Modem.

  5. Engineering Researchers Use AI And 3D Printing To Reinvent Microwave Circuit Design 5/26/2026

    A research team Florida A&M University and the FAMU-FSU College of Engineering has developed a new way to design and build microwave circuits—the high-frequency electronic components that underpin wireless communications, radar and sensing systems—using artificial intelligence and 3D printing.

  6. Keysight To Showcase Spectrum Innovations At IMS 2026 5/26/2026

    What: At the 2026 IEEE MTT-S International Microwave Symposium (IMS), Keysight Technologies will showcase solutions that help engineers accelerate spectrum utilization by solving complex RF design, emulation, and validation challenges.

  7. Ampleon Expands 5G RF Portfolio With High-Efficiency 70 W GaN Doherty Transistor For 3.4–4.0 GHz Applications 5/26/2026

    Ampleon announce the C5H3440N70D, a 70 W GaN Doherty RF power transistor engineered to deliver high efficiency, broadband performance and excellent linearity for next-generation massive MIMO base stations.

  8. Powered By Silicon Labs, Comminent Ships 500,000 Wi-SUN Modules 5/21/2026

    Comminent®, an innovator in next-generation IoT communication network platforms, and Silicon Labs (NASDAQ: SLAB), the leading innovator in low-power wireless, today announced a major milestone for India's smart grid infrastructure with the successful shipment of over 500,000 Wi-SUN-compliant communication modules powered by Silicon Labs' EFR32FG28 Wireless SoC.

  9. Cellnex Becomes Lead Customer For Ericsson's High-Power MINI-LINK 6356 E-Band Radio 5/21/2026

    Additionally, Cellnex is carrying out a large-scale deployment of the Ericsson Transport Automation Controller for the microwave backhaul, bringing real-time data analysis and AI-driven automation and smarter network management.

  10. AmpliTech Group's 5G 64T64R MIMO Cellular Radio Platform Supports Evolution Of AI-Enabled Wireless Infrastructure At Northeastern University 5/21/2026

    AmpliTech Group, Inc. (Nasdaq: AMPG, AMPGR, AMPGZ), a designer, developer, and manufacturer of advanced RF and microwave signal processing components and 5G infrastructure systems, today announced that its O-RAN CAT B 64T64R Massive MIMO radio unit served as the central hardware platform in Northeastern University's demonstration of the world's first open-source prototype of a Massive MIMO AI-RAN system, conducted by the Institute for Intelligent Networked Systems (INSI) Open6G OTIC in combining an Amplitech MIMO O-RAN Category B radio unit, NVIDIA AI Aerial software for layer 1 and layer 2 RAN.