Newsletter | November 7, 2019

11.07.19 -- Understanding RF Signal-Combining Technologies

 
Featured Article
Understanding RF Signal-Combining Technologies
By James Price, Corry Micronics, Inc.

This article explores options for combining or separating signals and is intended to help engineers determine which component -- or combination of components -- is most advantageous, given the application.

Resources
Designing For Today’s Connected Applications
White Paper | By James Connors and David Erickson, TE Connectivity

A designer’s project quickly becomes more complicated with the rapid evolution of connected technology. TE Connectivity (TE) is equipped with readily available global engineering expertise. Our teams rapidly work around the globe to understand the ins and outs of each subsystem design, including motors, pumps, heaters, control boards and power systems. TE has the global footprint and knowledge to understand how these subsystems work together across many different industries. This article identifies key areas to consider when designing for efficiency, reliability, and connectivity in today’s connected applications.

Components For 5G - What Is New?
Application Note | Rohde & Schwarz GmbH & Co. KG

With the next big step in mobile communication, 5G will introduce new RF techniques, new frequencies and signal bandwidths. Ultimately, 5G New Radio (5G NR) will bring higher speed, reduced latency, more capacity and improved reliability. While the system parameters will change, the hardware to enable the new major step in mobile technology towards 5G NR will be different as well. New technologies will be deployed and designs have to follow the new requirements.

Specifying RF/Microwave Power Amplifiers for EMC Testing – HIRF And High Frequency Field Generating Systems
Application Note | AR

This article is part three of AR’s series “Specifying RF/Microwave Power Amplifiers for EMC Testing,” and details the design requirements for HIRF and high frequency field generating systems.

Flexibility Of Multilayer Ceramic Capacitors
Application Note | Knowles Precision Devices DLI

Mechanical cracking resistance can be increased by two methods; by reducing the mechanical stress being exerted on the capacitors by PCB design/assembly processes, and by increasing the mechanical strength of the component. This article takes a look at both approaches and will examine Knowles Capacitors’ approach to increasing the mechanical strength through FlexiCap™.

Industry News
Featured Multimedia
Video: Introduction To CT Cables For Phase Critical Applications
 

HUBER+SUHNER’s CT product family is designed for phase critical applications and creates a stable and reliable interconnect solution to satisfy a huge range of customer applications where phase stability is key. These products provide the industry leading phase vs. temperature performance, as well as a unique range of cable constructions to fulfil any customer demands.

Bulletin Board
Pentek Electonic Design eBook

This eBook by Pentek focuses on RFSoC FPGA deployment strategies, since these products are powerful solutions for addressing the most demanding requirements of high-bandwidth and high-channel-count systems. This download also compares RFSoC with current trends in A/D and D/A converters, and the strategies for getting the highest performance levels out of these products.