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Remtec designs, develops and fabricates metalized ceramic substrates and packages using its plated copper-on-ceramic technology- POWER BOARD technology.The ceramic POWER BOARD represents a major breakthrough in multilayer circuit board technology. It combines the excellent thermal and mechanical features of ceramics with all of the electrical and thermal advantages of pure copper metalization. This combination allows design engineers the freedom to reduce size, increase power circuit density and achieve better thermal and electrical performance of their products. Remtec services a broad range of industries from elecommunications and computers to power supplies and medical electronics. Typical applications include high density DC/DC converters, RF power amplifiers, driver circuits, RF/microwave circuits, thermoelectric coolers, power hybrids, power modules, smart power, power packages, chip carriers and other power and RF assemblies.