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Skyworks Solutions, Inc., an innovator of high reliability analog and mixed signal semiconductors enabling a broad range of end markets,has introduced several highly integrated multimode power amplifier modules (PAMs) for next-generation smart phones and data cards requiring multiple wideband code division multiple access (WCDMA) bands. These solutions support up to five WCDMA bands and are optimized for specific mobile data requirements.

Skyworks' devices are ideal for today's handset OEMs, smart phone providers and reference design partners, among others, who are looking to meet consumers' demand for mobile Internet applications and always-on connectivity with innovative platforms in small form factors. According to Piper Jaffray, an equity research firm, global smart phone sales alone could increase from roughly 139 million units in 2008 to 400 million units in 2011, representing a 42 percent compounded annual growth rate.

Multi-Mode, Multi-Band Power Amplifier Module for Next Generation GGE and HSPA Handsets

Skyworks SKY77601 is a hybrid multi-mode, multi-band Power Amplifier Module (PAM). The device is intended to support 2.5G and 3G handsets and operates efficiently in GSM, EGPRS, EDGE WCDMA modes.

For 2.5G, the SKY77601 supports the GSM850, EGSM900, DCS1800, and PCS1900 bands. The device also supports 2.5G Class 12 Enhanced General Packet Radio Service (EGPRS) multislot operation and EDGE linear modulation.

For 3G, the PAM uses Load Insensitive Power Amplifier (LIPA?) circuitry to support WCDMA, High-Speed Downlink Packet Access (HSDPA), and High-Speed Uplink Packet Access (HSUPA) modulation at a high antenna Voltage Standing-Wave Ratio (VSWR). This functionality covers multiple bands for 3GPP including bands I, II, V, and VIII.

RF input and output ports are internally matched to 50 O to reduce the number of external components. Extremely low leakage current maximizes handset standby time.

The InGaP die, the silicon die, and passive components are mounted on a multi-layer laminate substrate. The assembly is encapsulated with plastic overmold.

The device is mounted in a 34-pin, 6 x 8 mm MCM Surface- Mounted Technology (SMT) package, which allows for a highly manufacturable low-cost solution.

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•Datasheet: SKY77601 Multi-Mode, Multi-Band Power Amplifier Module For Next Generation GGE And HSPA Handsets

Multi-Band, Multi-Mode (3G) Power Amplifier Module w/ PA Distribution Switch

The SKY77602 Power Amplifier Module (PAM) is a fully matched, 22-pad, surface mount module developed for Wideband Code Division Multiple Access (WCDMA) and CDMA2000 applications. This small and efficient module packs full coverage for WCDMA Bands I, II, IV, V, and VIII, and for CDMA2000 Bands I, II, IV, and V into a single compact package. The SKY77602 meets the stringent spectral linearity requirements of WCDMA/CDMA2000 transmission, with high power added efficiency for power output to 28 dBm for Bands I, IV, V, 28.5 dBm for Band II, and 28.3 dBm for Band VIII. The SKY77602 meets the stringent spectral linearity requirements of High Speed Downlink Packet Access (HSDPA) data transmission with high power added efficiency. An integrated directional coupler eliminates the need for any external coupler.

The SKY77602 PAM is manufactured with Skyworks' InGaP GaAs Heterojunction Bipolar Transistor (HBT) BiFET process that provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity. No regulated voltage is required. Power down is accomplished by setting the voltage on VEN_H or VEN_L to zero volts. No external supply side switch is needed as typical "off" leakage is a few microamperes with full primary voltage supplied from the battery.

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•Datasheet: SKY77602 Multi-Band, Multi-Mode (3G) Power Amplifier Module w/ PA Distribution Switch

Multi-Mode / Multi-Band Power Amplifier Module for Next Generation GGE and HSPA Handsets

Skyworks SKY77604 is a hybrid multi-mode, multi-band Power Amplifier Module (PAM) that supports 2.5G and 3G handsets, and operates efficiently in GSM, EGPRS, EDGE WCDMA modes. The PAM consists of a GSM800/EGSM900 PA block, a DCS1800/PCS1900 PA block, separate WCDMA blocks for low and high bands, RF input / output ports internally matched to 50 O to reduce the number of external components, and a Multi- Function Control (MFC) block. A custom BiCMOS integrated circuit provides the internal MFC interface and operation. Extremely low leakage current maximizes handset standby time.

2.5G: The SKY77604 supports the GSM850, EGSM900, DCS1800, and PCS1900 bands. The PAM also supports 2.5G Class 12 Enhanced General Packet Radio Service (EGPRS) multi-slot operation and EDGE linear modulation.

3G: The SKY77604 uses Load Insensitive Power Amplifier (LIPA?) circuitry to support WCDMA, High-Speed Downlink Packet Access (HSDPA), and High-Speed Uplink Packet Access (HSUPA) modulation at a high antenna Voltage Standing-Wave Ratio (VSWR). This functionality covers multiple bands for 3GPP including bands I, II, V, VIII.

The module is fully programmable through a Serial Peripheral Interface (SPI).

The InGaP die, the silicon die, and passive components are mounted on a multi-layer laminate substrate. The assembly is encapsulated with plastic overmold.

The SKY77604 is encapsulated in a 6 mm x 8 mm, 34-pad MCM, Surface-Mounted Technology (SMT) package, which allows for a highly manufacturable, low-cost solution.

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•Datasheet: SKY77604 Multi-Mode / Multi-Band Power Amplifier Module For Next Generation GGE And HSPA Handsets

Multiband Multimode Power Amplifier Module for Quad-Band GSM / EDGE and Broadband (Bands I, II, V, VIII) WCDMA / HSDPA / HSUPA / HSPA+ Handsets

Skyworks SKY77605 is a hybrid multimode, multiband Power Amplifier Module (PAM) that supports 2.5G and 3G handsets, and operates efficiently in GSM, EGPRS, EDGE and WCDMA modes.

The PAM consists of a GSM800/EGSM900 PA block, a DCS1800/PCS1900 PA block, separate blocks for WCDMA operating in low / high bands, RF I/O ports internally matched to 50 O to reduce the number of external components, a logic control block for multiple power control levels and band enable functions in both cellular and UMTS. Extremely low leakage current maximizes handset standby time.

GSM/EDGE: The SKY77605 uses a new compact architecture to support GSM850, EGSM900, DCS1800 and PCS1900 bands. The PAM also supports 2.5G Class 12 Enhanced General Packet Radio Service (EGPRS) multi-slot operation and EDGE linear modulation.

WCDMA: The SKY77605 uses Load Insensitive Power Amplifier (LIPA) circuitry to support WCDMA, High-Speed Downlink Packet Access (HSDPA), and High-Speed Uplink Packet Access (HSUPA) modulations at moderate antenna Voltage Standing-Wave Ratio (VSWR). This functionality covers multiple bands for 3GPP, including bands I, II, V, VIII, and operates at different power modes.

The module is fully controllable via three line logic and band enable interfaces. The InGaP/GaAs die and passive components are mounted on a multi-layer laminate substrate and the assembly encapsulated with plastic overmold. The SKY77605 Surface-Mounted Technology (SMT) package offers for a highly manufacturable, low-cost solution.

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•Datasheet: SKY77605 Multiband Multimode Power Amplifier Module For Quad-Band GSM / EDGE and Broadband (Bands I, II, V, VIII) WCDMA / HSDPA / HSUPA / HSPA+ Handsets

Multiband Multimode Power Amplifier Module for Quad-Band GSM / EDGE and Dual-Band (Band I and VIII) WCDMA / HSDPA / HSUPA / HSPA+ Handsets

Skyworks SKY77607 is a hybrid multimode, multiband Power Amplifier Module (PAM) that supports 2.5G and 3G handsets, and operates efficiently in GSM, EGPRS, EDGE and WCDMA modes.

The PAM consists of a GSM800/EGSM900 PA block, a DCS1800/PCS1900 PA block, separate blocks for WCDMA operating in low / high bands, RF I/O ports internally matched to 50 O to reduce the number of external components, a logic control block for multiple power control levels and band enable functions in both cellular and UMTS. Extremely low leakage current maximizes handset standby time.

GSM/EDGE: The SKY77607 uses a new compact architecture to support GSM850, EGSM900, DCS1800 and PCS1900 bands. The PAM also supports 2.5G Class 12 Enhanced General Packet Radio Service (EGPRS) multi-slot operation and EDGE linear modulation.

WCDMA: The SKY77607 uses Load Insensitive Power Amplifier (LIPA) circuitry to support WCDMA, High-Speed Downlink Packet Access (HSDPA), and High-Speed Uplink Packet Access (HSUPA) modulations at moderate antenna Voltage Standing-Wave Ratio (VSWR). This functionality covers multiple bands for 3GPP, including bands I, VIII, and operates at different power modes.

The module is fully controllable via three line logic and band enable interfaces. The InGaP/GaAs die and passive components are mounted on a multi-layer laminate substrate and the assembly encapsulated with plastic overmold. The SKY77607 Surface-Mounted Technology (SMT) package offers for a highly manufacturable, low-cost solution.

Click Here To Download:
•Datasheet: SKY77607 Multiband Multimode Power Amplifier Module For Quad-Band GSM / EDGE And Dual-Band (Band I and VIII) WCDMA / HSDPA / HSUPA / HSPA+ Handsets