Latest Headlines

  1. Samsung And Qualcomm Achieve Industry-First Power Class 1 Validation For 5G Fixed Wireless Access On Virtualized RAN 5/6/2026

    Samsung Electronics today announced a significant advancement in Fixed Wireless Access (FWA) technology, successfully validating 5G Power Class 1 (PC1) capability through its virtualized RAN (vRAN) and the Qualcomm Dragonwing FWA Gen 4 Platform featuring the Qualcomm X85 Modem-RF chipset.

  2. C-COM Receives $1.35M In Antenna Orders 5/5/2026

    C-COM Satellite Systems Inc., a leading global provider of commercial grade mobile auto-deploying satellite antenna systems, announced today that it has received $1.35M worth of orders for its iNetVu antenna systems.

  3. Ampleon Launches High-Voltage LDMOS Macro Driver Platform With Integrated Doherty MMICs For Efficient, Simplified 4G/5G Base Stations, Featuring A 2.6 GHz Flagship Driver 5/4/2026

    Ampleon announces the B10H27N70D, a flagship product in its novel High-Voltage LDMOS Macro Driver platform, enabling uncompromised drive of high-power GaN-SiC transistors in macro base stations.

  4. Optical Antenna Allows In-Flight Communication Between Drones Using UV Light 4/30/2026

    Researchers have developed a new optical antenna for wireless ultraviolet (UV) communication that captures and amplifies signals from a broad area.

  5. Broadcom Accelerates Multi-Gig Broadband With Optimized 10G PON And Wi-Fi 8 Solutions For Mass Market 4/30/2026

    Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops, and supplies semiconductor and infrastructure software solutions, today announced its fourth wave of Wi-Fi 8 chips and an optimized 10G PON chip, solidifying its broadband industry leadership by extending the benefits of IEEE 802.11bn for service providers in hyper-competitive average revenue per user (ARPU) constrained broadband markets.

  6. Eliminate Magnetic Interference With MCX Connectors Designed With Non-Ferrous Materials 4/30/2026

    Amphenol RF is pleased to announce the expansion of our non-magnetic MCX product series with additional coaxial connector configurations.

  7. Rohde & Schwarz Highlights New High Gain Antennas And Fast EMI Testing At APEMC 2026 In Kuala Lumpur 4/29/2026

    Rohde & Schwarz will present at the IEEE Asia‑Pacific International Symposium on Electromagnetic Compatibility (APEMC 2026) in Kuala Lumpur as a Silver Sponsor.

  8. Ampleon Introduces Fully Integrated 3-Stage LDMOS Doherty MMIC Enabling Compact, High-Efficiency 3.6–4.0 GHz Small Cell And Massive MIMO Designs 4/29/2026

    Ampleon announces the B10G3640N16DL, a fully integrated 3-stage LDMOS Doherty MMIC designed to simplify RF power amplifier design while delivering high gain, efficient and reliable performance for wireless infrastructure, like small cells and massive MIMO base stations.

  9. New Samtec SMA Interconnects Capable Of 26.5 GHz 4/28/2026

    Samtec, Inc., the service leader in the connector industry, announces production quantity availability of its new high-frequency, 50 Ohm impedance, SMA edge-mount board connector delivering repeatable, reliable performance through 26.5 GHz.

  10. ISCO International And Abside Networks Deliver Advanced 5G Anti-Jamming Resiliency 4/28/2026

    ISCO International, a leader in signal interference cancellation technology, and Abside Networks, a provider of advanced wireless communications solutions, announced the availability of ISCO's Interference Management and Cancellation (IMC) software in Abside's next-generation 5G and Open RAN platforms.