Latest Headlines
-
Qorvo® Simplifies RF Control With SOI Portfolio That Eliminates Negative Bias
6/8/2026
As defense, aerospace, and infrastructure systems demand wider bandwidths, more agile signal routing, and faster deployment cycles, RF designers are under increasing pressure to simplify increasingly complex architectures.
-
Optical Wireless Quantum Security: Free-Space QKD And Li-Fi In One System
6/2/2026
The German consortium QuINSiDa has achieved a major step towards mobile quantum-secure communication.
-
Airoha Technology Partners With E Ink For Global Debut Of 4.2-Inch Ripple™ ESL At Computex 2026
6/1/2026
Airoha Technology today announced its inaugural exhibition at the ePaper Pavilion during Computex 2026. Leveraging 20 years of deep technological expertise in wireless transmission, Airoha's Bluetooth® audio chips have earned widespread adoption and validation from global Tier-1 acoustic brands.
-
Morse Micro Announces MM8108-M20 High-Power Wi-Fi HaLow Module To Accelerate Long-Range IoT Adoption
6/1/2026
Morse Micro, the world’s leading Wi-Fi HaLow silicon provider, today announced the MM8108-M20, a high-power Wi-Fi HaLow module designed to help product teams in the US and Canada bring long-range, low-power Wi-Fi HaLow devices to market faster.
-
Baylin Technologies Completes Acquisition Of Kaelus AB, Creating A Unified End-To-End RF Portfolio
5/29/2026
Baylin Technologies Inc. (“Baylin” or the “Company”) today announced that it has completed the previously announced acquisition of Sweden-based Kaelus AB (“Kaelus”), a global provider of wireless infrastructure antenna and radio frequency (“RF”) equipment (the “Acquisition”).
-
u-blox Expands Collaboration With Nordic Semiconductor, Introducing ALMA-B2 Modules With Low-Latency Edge ML Capabilities
5/28/2026
u-blox, a global leader in positioning and short-range communication technologies for automotive, industrial, and consumer markets, today announced the expansion of its short-range radio portfolio with new low-latency Edge Machine Learning (Edge ML) capabilities.
-
Qorvo Eliminates Cascaded Switches In 5G Radios With New Wideband High-Isolation Family
5/27/2026
Qorvo, a leading global provider of connectivity and power solutions, today announced a new family of RF switches designed to simplify multi-band radio architectures.
-
Broadcom Unveils World's First Integrated 5G And Wi-Fi 8 FWA Platform In Collaboration With Samsung Electronics
5/27/2026
Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops, and supplies semiconductor and infrastructure software solutions, today announced its collaboration with Samsung Electronics Co., Ltd. on a new, broadband-optimized reference platform for the global fixed wireless access (FWA) market, integrating Broadcom's BCM6776 Wi-Fi 8 System-on-Chip (SoC) with Samsung's B1320 5G Modem.
-
Engineering Researchers Use AI And 3D Printing To Reinvent Microwave Circuit Design
5/26/2026
A research team Florida A&M University and the FAMU-FSU College of Engineering has developed a new way to design and build microwave circuits—the high-frequency electronic components that underpin wireless communications, radar and sensing systems—using artificial intelligence and 3D printing.
-
Keysight To Showcase Spectrum Innovations At IMS 2026
5/26/2026
What: At the 2026 IEEE MTT-S International Microwave Symposium (IMS), Keysight Technologies will showcase solutions that help engineers accelerate spectrum utilization by solving complex RF design, emulation, and validation challenges.