CW Operation Of QFN-Packaged Pulsed GaN Power Amplifiers

Improvements have been made to GaN amplifiers at microwave frequencies that have increased their generated output power levels while also shrinking the size of the system. These developments, however, present the challenge of providing sufficient thermal management. This Qorvo® application note discusses the thermal issues involved with using high-powered, small packaged (e.g. QFN) GaN amplifiers within high power CW systems. Download the full paper for considerations on component mounting in order to provide a low thermal impedance path to the system heat sink for optimum operation and reliability, using the TGA2307-SM as an example.