SyChip Introduces WiMAX 2.5 GHz Chip Scale Module
The SyMax platform includes the WiMAX9xxx hardware and all the software necessary to provide a turnkey system for WiMAX enabled devices. The CSM consist of a baseband/MAC IC, a radio frequency transceiver, a power amplifier and on-board memory and matching components. The software suite includes drivers and application layer interfaces that will allow content providers, manufacturers, and original equipment manufacturers the flexibility to integrate and optimize their respective applications (VoIP, Video/Audio streaming), host interfaces (SDIO, SPI, Half Mini-card) and operating systems (Windows Mobile, Linux).
"The SyMax family of products leverages our leadership and know how in the plug-n-play embedded space and wireless connectivity. It will provide our customers a quick time-to-market solution as well as minimize their upfront investment. We are seeing the benefits already with the chipset vendors that we are working with," said Moses Asom, SyChip co-founder and senior vice president of marketing and business development. "This directly correlates to what is happening in the market. According to IDC, WiMax technology experienced the most substantial growth in the telecommunication market, jumping 140 percent since 2005."
Engineering samples, which come in RoHS compliant packaging, will be made available in August 2007. Volume production is scheduled to begin during the second quarter of 2008.
SOURCE: SyChip, Inc.