GlobeNewswire Press

41. RFMD's PowerSmart Wins Compound Semiconductor Industry's Most Innovative Device Award
    3/31/2011
    RF Micro Devices, Inc., a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, has announced that Compound Semiconductor magazine has recognized the Company's PowerSmart power platform (RFRD6460) as the compound semiconductor industry's most innovative device of 2011.
42. Iridium 9602 Transceiver Opens Up Data Connectivity In Broad New Markets
    1/20/2011
    Iridium Communications Inc. announced the certification of new Iridium 9602 Short Burst Data (SBD) Transceiver-based partner devices, opening a broad number of emerging new markets with solutions enabled by Iridium data connectivity.
43. Northrop Grumman Proves Wireless Capabilities Of Multi-Role Tactical Common Data Link In Simulated Disaster Demo
    12/6/2010
    Northrop Grumman Corporation has successfully demonstrated a wireless communications capability extending the Multi-Role Tactical Common Data Link (MR-TCDL) system, increasing its reach and speed while readily restoring communications during a simulated disaster.
44. Giga-tronics Receives Orders In Excess Of $4.8M
    12/1/2010
    Giga-tronics Incorporated announced today that it has received orders in excess of $4.8M to supply microwave test equipment for the automation of production at contract manufacturers in China.
45. Microsemi Corporation To Acquire Actel Corporation
    10/5/2010
    Microsemi Corporation (Nasdaq:MSCC), a leading manufacturer of high performance analog mixed-signal integrated circuits, high reliability semiconductors and RF subsystems, announced today that it has entered into a definitive agreement to acquire Actel Corporation (Nasdaq:ACTL) for $20.88 per share through a cash tender offer.
46. RFMD® Commences Volume Shipments Of Next-Generation WCDMA/HSPA+ Power Amplifiers For Smart Phones And 3G Devices
    8/17/2010
    RF Micro Devices, Inc., a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, today announced it has commenced high-volume production shipments of its RF720x WCDMA/HSPA+ power amplifiers (PAs) to leading smart phone and 3G device manufacturers in Korea and China.
47. RFMD Introduces RF5365 WiFi Front End Module
    7/14/2010
    RF Micro Devices, Inc., a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, today announced availability of the RF5365 WiFi front end module (FEM).
48. RFMD Expands Family Of Front End Modules For ZigBee®-Based Smart Energy And ISM Applications
    7/7/2010
    RF Micro Devices, Inc., a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, today announced the availability of the RF6515 front end module (FEM).
49. RFMD Introduces RF3482 Single-Chip Integrated Front End Module
    7/1/2010
    RF Micro Devices, Inc. (Nasdaq:RFMD), a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, today announced the availability of the RF3482 front end module (FEM). RFMD's highly integrated RF3482 single-chip FEM integrates a WiFi power amplifier with a single-pole, three-throw (SP3T) switch for 2.4 GHz to 2.5 Ghz ISM band applications.
50. RFMD Introduces Highly Integrated Amplifier For Mobile PC And Embedded Applications
    6/29/2010
    RF Micro Devices, Inc., a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, today announced availability of the RF5616, a highly integrated 4.9 GHz - 5.8 GHz (ISM band) 3mm x 3mm power amplifier designed to significantly reduce customers' total solution size and cost.